Form Control In Atmospheric Pressure Plasma Processing Of Ground Fused Silica
Duo Li,Bo Wang,Qiang Xin,Huiliang Jin,Jun Wang,Wenxia Dong
DOI: https://doi.org/10.1117/12.2069851
2014-01-01
Abstract:Atmospheric Pressure Plasma Processing (APPP) using inductively coupled plasma has demonstrated that it can achieve comparable removal rate on the optical surface of fused silica under the atmosphere pressure and has the advantage of inducing no sub-surface damage for its non-contact and chemical etching mechanism. APPP technology is a cost effective way, compared with traditional mechanical polishing, magnetorheological finishing and ion beam figuring. Thus, due to these advantages, this technology is being tested to fabricate large aperture optics of fused silica to help shorten the polishing time in optics fabrication chain. Now our group proposes to use inductively coupled plasma processing technology to fabricate ground surface of fused silica directly after the grinding stage. In this paper, form control method and several processing parameters are investigated to evaluate the removal efficiency and the surface quality, including the robustness of removal function, velocity control mode and tool path strategy. However, because of the high heat flux of inductively coupled plasma, the removal depth with time can be non-linear and the ground surface evolvement will be affected. The heat polishing phenomenon is founded. The value of surface roughness is reduced greatly, which is very helpful to reduce the time of follow-up mechanical polishing. Finally, conformal and deterministic polishing experiments are analyzed and discussed. The form error is less 3%, before and after the APPP, when 10um depth of uniform removal is achieved on a 60x60mm ground fused silica. Also, a basin feature is fabricated to demonstrate the figuring capability and stability. Thus, APPP is a promising technology in processing the large aperture optics.