Abstract:Cu is commonly used in the field of electricity and electronics because of its high ductility, and electrical and thermal conductivity. The thermophysical properties and the atomic structure of liquid Cu, especially for undercooled state, are of practical significance in both application and fundamental researches. The major approaches to obtain thermophysical properties of undercooled metals are containerless techniques based on electrostatic levitation, electromagnetic levitation and ultrasonic levitation et al. However, the strong volatility of liquid Cu results in great difficulties to measure the thermophysical properties. Accordingly, computational prediction is becoming an expected method to obtain the thermophysical data of liquid Cu. The molecular dynamics ( MD) simulation, in combination with a resonable potential model, has been extensively employed in studying the physical properties of several metals as a powerful approach. In this work, the atomic distribution and thermophysical properties including melting temperature, density, specific heat and self-diffusion coefficient of liquid Cu were studied by molecular dynamics simulation. Mishin's and Zhou's embedded-atom method potentials, and the modified embed-ded-atom method potential proposed by Baskes were used over the temperature range of 800 similar to 2400 K, reaching the maximum undercooling of 556 K. The simulated results are in good agreement with the reported experimental results. The crystal-liquid-crystal sandwich structure has been used to calculate the melting point. The melting point calculated by Baskes' potential model is 1341 K, just a difference of 1.11% from the experimental value. The density at the melting point calculated by Mishin's potential is 7.86 g/cm(3), with a difference less than 2% compared with the reported data. It is found that the enthalpy of liquid Cu increases linearly with the increase of temperature. The specific heat is obtained to be 31.89 J/(mol . K) by Mishin's potential, which is constant in the corresponding temperature range. The self-diffusion coefficient is exponentially dependent on the temperature. The maximum error between the reported value and the present value of the self-diffusion coefficient calculated by Mishin's potential is only 4.93%. The pair distribution function was applied to investigate the atomic structure of liquid Cu, which suggests that the simulated system is still ordered in short range and disordered in long range for both normal liquid and undercooled state. It is found that the atomic ordered degree is weakened with the increase of temperature, and it is kept within 3 similar to 4 atom neighbor distance.

Molecular-dynamics Simulation of Structural Changes of a Molten Cu555 Cluster During Freezing

Molecular Dynamics Study of Freezing A Molten Cu-55 Cluster on Cu(010) Surface

Molecular dynamics investigations of structural changes accompanying with freezing a molten Cu135 cluster on cooling

Structural Changes During Freezing and Coalescing of Small Sized Clusters on Atomic Scale

Molecular Dynamics Study of Structural Changes in Freezing Clusters

Modeling the Freezing of Molten Copper Nanoclusters: the Effect of Quenching Temperature and Cluster Size

Molecular Dynamics Simulations of A Molten Cu-55 Cluster Embedded in Face-Centred Cubic Bulk During Solidification

Molecular Dynamics Study Showing the Effect of Quenching Temperature on Structural Changes of A Molten Cu-411 Cluster

Modeling Structural Changes on Cooling A Molten Cu-55 Cluster by Molecular Dynamics

Molecular Dynamics Simulation of Relaxation and Local Structure Change of A Molten Cu-135 Cluster During Rapidly Quenching

Molecular Dynamics Study of Relaxation and Local Structure Changes in A Rapidly Quenched Molten Cu-57 Cluster

Melting and Crystallization in Large Sized Copper Cluster

Simulation Study of the Effets of Various Cooling Rates on Evolution Properties of Micro-Cluster Structure During Solidification Processes of Liquid Metal Cu

Structural Evolution of Cu During Rapid Quenching by Ab Initio Molecular Dynamics

Coalescing Dynamics Between Ag55 and Cu55 Clusters As Well As Thermodynamics During Cooling the Coalesced Clusters from Atomic Simulations.

Structural Evolution During Crystallization of Rapidly Super-Cooled Copper Melt

Thermophysical Properties and Atomic Distribution of Undercooled Liquid Cu

Simulation Study of Effect of Cooling Rate on Evolution of Microstructures During Solidification of Liquid Metal Cu

Simulation Study on the Formation and Transition Properties of Cluster Structures in Liquid Metals During Rapid Cooling Processes

Molecular Dynamics Investigation of Differences in Melting Behaviors of Cu57 and Cu58 Clusters

Molecular Dynamics Simulation on Structural Evolution During Crystallization of Rapidly Super-Cooled Cu50Ni50 Alloy