Theoretical Analysis of Temperature Field in Surface Grinding with Cup Wheel

B Lin,HL Zhang
DOI: https://doi.org/10.4028/www.scientific.net/kem.202-203.93
2001-01-01
Key Engineering Materials
Abstract:A moving heat source model of cup wheel surface grinding is built. Three-dimensional quasi-steady temperature field in workpiece without coolant is analyzed and its formula is obtained based on this thermal model and the theory of heat conduction. The theoretical calculation shows that cup wheel surface grinding temperature field takes on non-uniform shape. The result is also helpful to analyses other thermal problems emerged in mechanical operations such as cutting and milling.
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