Abstract:The virtual metrology model using tree-based ensemble models in semiconductor wafer physical vapor deposition (PVD) is verified with high predict accuracy and good performance.The virtual metrology model using tree-based ensemble model in semiconductor PVD process is significantly better than LASSO regression, partial least squares regression, support vector machine, Gaussian process regression and artificial neural network regression.The performance of virtual metrology model based on SMBO with surrogate model can find better hyperparameters faster and obtain higher virtual metrology accuracy comparing to the commonly used random search hyperparameter optimization method.In order to improve the accuracy of semiconductor wafer virtual metrology, and overcome the physical metrology delay of wafer acceptance test, a virtual physical vapor deposition metrology method based on combination of tree-based ensemble models is proposed to conduct online virtual metrology on semiconductor wafer electrical parameters, and use hyperparameter optimization technique to perform model optimization and to achieve real-time alarm on process deviation. This combination of tree-based ensemble model combines Bagging, Boosting, and Stacking techniques. First, based on 4 types of base learner, Random Forest, Extra-Trees, XGBoost, and lightGBM, preliminary virtual metrology is performed on wafer PVD process, and then transforms the predict results of the 4 base learners into meta feature vector as the input of meta learner lightGBM to perform further virtual metrology. The Sequential model-based optimization algorithm is used to improve the accuracy of virtual metrology. First, the initial hyperparameter of the sequential model-based optimization is initialized by using random sampling, then the combination model is approximated by the surrogate model of tree-structured Parzen estimator, and the recommended hyperparameters is obtained by using EI (Expected Improvement), and then the optimized combination model is obtained. Finally, the superiority of the method proposed in this paper is verified by studying the results comparing to the common virtual metrology methods on the PVD process. The experiment shows the result of resistivity metrology using the combination of tree-based ensemble models in the PVD process is significantly better than LASSO regression, partial least squares regression(PLSR), support vector machine(SVR), Gaussian process regression(GPR) and artificial neural network regression(ANN).

Development of Virtual Metrology Algorithm for the High Mixed Manufacturing Process

Just-In-Time Modeling with Variable Shrinkage Based on Gaussian Processes for Semiconductor Manufacturing

In situ monitoring for numerical controlled manufacturing of large conceptual prototype based on multi-view stitching fusion

Development of Convolutional Neural Network Based Gaussian Process Regression to Construct a Novel Probabilistic Virtual Metrology in Multi-Stage Semiconductor Processes

Virtual metrology algorithm for TFT-LCD manufacutring process

A Virtual Metrology System for Predicting End-of-Line Electrical Properties Using a MANCOVA Model With Tools Clustering.

A hierarchical model-based method for wafer level virtual metrology under process information deficiency

Virtual Metrology for Multistage Processes Using Variational Inference Gaussian Mixture Model and Extreme Learning Machine

Adaptive Virtual Metrology Method Based on Just-in-time Reference and Particle Filter for Semiconductor Manufacturing

Product Quality Improvement Method In Manufacturing Process Based On Kernel Optimisation Algorithm

A Virtual Metrology Model Based on Recursive Canonical Variate Analysis with Applications to Sputtering Process

Machine Learning based CVD Virtual Metrology in Mass Produced Semiconductor Process

Virtual metrology for chemical mechanical planarization of semiconductor wafers

Virtual metrology of semiconductor PVD process based on combination of tree-based ensemble model

A Digital Twin-Based Analysis Method to Assess Geometric Variations for Parts in Batch Production

Statistical Key Variable Analysis and Model-Based Control for Improvement Performance in A Deep Reactive Ion Etching Process

VMMC: a Test-Bed for Machining

Metrology and Manufacturing-Integrated Digital Twin (MM-DT) for Advanced Manufacturing: Insights from CMM and FARO Arm Measurements

Virtual metrology for enabling zero-defect manufacturing: a review and prospects

Phase Partition Based Virtual Metrology for Material Removal Rate Prediction in Chemical Mechanical Planarization Process

Virtual metrology in semiconductor manufacturing: Current status and future prospects