Nanostructure and Thermal Stability of Electroplated Chromium Layer

WANG Fei-fei,REN Rui-ming,CHEN Chun-huan,KOU Tang-shan
DOI: https://doi.org/10.3321/j.issn:1007-9289.2007.03.007
2007-01-01
China surface engineering
Abstract:The nanostructure of electroplated chromium layer with thickness of 150 μm prepared by industrial chromium electroplating method was studied on 08F mild steel by means of X-ray diffraction(XRD),scanning electron microscopy(SEM)with energy dispersion spectrometer(EDS),transmission electron microscopy(TEM),as well as microhardness test.Its corresponding thermal stability ranging from 200 ℃ to 600 ℃ was analyzed.The results showed that the original grains,about 10 nm in size,grew to more than 100 nm after annealing at 500 ℃.The interdiffusion layer between chromium layer and mild steel became thicker and thicker with the increase of annealing temperature.Meanwhile,the microhardness of chromium layer declined continuously,when the temperature was over 400 ℃,the falling rate of hardness started to speed up.
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