Effects of Grain Boundary Adhesion and Grain Size on Ductility of Thin Metal Films on Polymer Substrates

Zhao Zhang,Teng Li
DOI: https://doi.org/10.1016/j.scriptamat.2008.06.058
IF: 6.302
2008-01-01
Scripta Materialia
Abstract:We have studied the effects of grain boundary adhesion and grain size on the ductility of thin metal films well bonded to polymer substrates, using a finite element method. It is shown that the ductility of polymer-supported metal films increases approximately linearly as the grain boundary adhesion increases, and as the grain size decreases. A rule-of-thumb estimate of the ductility of polymer-supported metal films agrees well with the simulation results. (c) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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