Abstract:The aim of this study is to investigate the effects of various process parameters (the grinding-wheel speed, feed rate, workpiece speed, spark-out grinding time, and grinding-wheel granularity) on the surface quality of single-crystal SiC during nanogrinding while concurrently analysing the grinding mechanism and optimising the overall process. Experiments are performed to investigate the macrotexture and micromorphology of the single-crystal SiC surface. By employing image-processing technology, the proportion of brittle and plastic removal components is determined, thus facilitating a comprehensive analysis into the removal mechanism and the subsequent establishment of a material-removal model. The findings indicate that after grinding, the surface of single-crystal SiC exhibits a distinct grinding trajectory that radiates outwards from the centre, the density of the grinding trajectory is higher in the central area than at the periphery. The overall surface roughness increases from the centre to the edge. As the grinding-wheel speed increases, the feed rate decreases, the spark-out grinding time is prolonged, the grinding-wheel granularity increases, the abrasive cutting depth of the diamond grinding wheel decreases, the proportion of brittle removal on the surface of single-crystal SiC decreases, the proportion of plastic removal increases, the grinding groove becomes shallow, and the density of the groove increases significantly. Under the optimal process parameters, the surface roughness is reduced to 5.35 nm, and the smooth mirror effect is achieved via grinding.

Optimizing of Grinding Parameters and Research of Grinding Mechanism of Reaction-bond Silicon Carbon

Machining Characteristics And Removal Mechanisms Of Reaction Bonded Silicon Carbide

Grinding Characteristics of Reaction Bonded Silicon Carbide

Effect of Ultrasonic Vibration Assisted Grinding Process on Surface Topography and Properties of C/SiC Composite

Studies on the Surface Quality of the Unsteady-State Grinding Technique

Mechanism analysis and process optimization of nanogrinding single-crystal SiC

Influence of diamond wheel grinding process on surface micro-topography and properties of SiO2/SiO2 composite

Surface/subsurface Observation and Removal Mechanisms of Ground Reaction Bonded Silicon Carbide

Enhancing the grinding performance of RB-SiC ceramic using abrasive water jet dressed diamond grinding wheels

Study on Grinding Surface Deformation and Subsurface Damage Mechanism of Reaction-Bonded SiC Ceramics

Experimental Investigation on the Surface and Subsurface Damages Characteristics and Formation Mechanisms in Ultra-Precision Grinding of SiC

Experimental investigation on the feasibility of high-efficiency and precision grinding of silicon carbide ceramics with monolayer brazed diamond wheel

Amorphization and C segregation based surface generation of Reaction-Bonded SiC/Si composites under micro-grinding

Material removal mechanism of laser-assisted grinding of RB-SiC ceramics and process optimization

Impact of Material Microstructure and Diamond Grit Wear on Surface Finish in Micro-Grinding of RB-SiC/Si and WC/Co Carbides

Laser-assisted Grinding of Reaction-Bonded SiC

Experimental Investigation on Materials Removal Mechanism During Grinding Silicon Carbide Ceramics with Single Diamond Grain

Ductile Mode Grinding of Reaction-Bonded Silicon Carbide Mirrors

The Influence of Grain Geometry and Wear Conditions on the Material Removal Mechanism in Silicon Carbide Grinding with Single Grain

Research on micro-grinding performance of 2.5D Cf/SiC composites

Material removal characteristics of ultra-precision grinding silicon carbide ceramics