LED Wafer Edge Detection of an Improved Canny Algorithm

智少丹,李建勇,王恒

DOI: https://doi.org/10.3969/j.issn.1001-4551.2010.08.003

2010-01-01

Abstract:In order to improve the automation level of the die bonder's detection and the quality of extracted edge,an improved Canny edge-detecting algorithm was proposed based on Otsu for detecting the LED wafer edges.The proposed approach avoids artificial adjustment needed in Canny algorithm with fixed threshold value,and enhances the accommodation and robustness of the Canny edge-detecting algorithm.After the pixel value distributing analysis,maximum-variance between classes was used to obtain auto-adaptive threshold.And the value was made as the lower threshold one to detect the edge.The experiment results show that,this method is adapted to LED wafer edge-detecting.It can obtain more accurate wafer outline and poles edges and stay robust under the changed illumination.