Effect of the addition of CeO 2 nanoparticles on the microstructure and shear properties of Sn-57Bi-1Ag solder alloy
Lei Zhang,Wenchao Yang,Junli Feng,Weiou Qin,Da Qi,Shijie Song,Yongzhong Zhan
DOI: https://doi.org/10.1016/j.jmrt.2023.07.260
IF: 6.267
2023-08-05
Journal of Materials Research and Technology
Abstract:In this study, different weight fractions (0, 0.2, 0.5, 0.7, and 1.0 wt.%) of cerium oxide (CeO 2 ) nanoparticles were used to enhance the properties of Sn-58Bi-1Ag (SBA) solder alloys. As expected in the design, the CeO 2 nanoparticles are diffusely distributed in the solder matrix. The microstructure evolution, growth of intermetallic compound (IMC) at the interface, and shear properties of the composite solder were systematically investigated using a scanning electron microscope (SEM) equipped with energy-dispersive X-ray spectroscopy (EDS) and electron backscatter diffraction (EBSD) probes. The results showed that adding an appropriate amount of CeO 2 nanoparticles can refine the microstructure of the composite solder. Many β-Sn twin structures were observed in the SBA-0.5CeO 2 and SBA-0.7CeO 2 solder matrix, bringing better deformability to the β-Sn phase and improving the plasticity of the solder matrix. Moreover, with the addition of nanomaterials, there was a notable decrease in the thickness of the interfacial IMC layer of the solder/Cu joint, accompanied by a refinement in the grain size of the IMC. To our satisfaction, the addition of CeO 2 nanoparticles in the appropriate proportion exhibited a remarkable enhancement in both shear strength and toughness of the composite solder alloys, working in tandem to transform the fracture mechanism from a purely brittle mode to a mixed mode of ductility and brittleness. It is indicated that the doping of CeO 2 improves the reliability of SBA solder, potentially paving the way for a novel approach to particle-enhanced modification of Sn-Bi-Ag-based low-temperature solders.
materials science, multidisciplinary,metallurgy & metallurgical engineering