High‐gain W‐band‐printed antenna on flexible substrate
Balaka Biswas,Ayan Karmakar,Vaibhav Adhikar,Chinmoy Saha
DOI: https://doi.org/10.1002/dac.5755
2024-03-02
International Journal of Communication Systems
Abstract:This article demonstrates a novel type of series‐fed planar antenna array for a W‐band (70 GHz) application. The proposed architecture is a 5‐element antenna array with 10 numbers of gap‐coupled parasitic patches in microstrip configuration over a thin, flexible and bio‐compatible substrate named LCP (liquid crystal polymer). The proto version of the antenna offers peak directive gain of about 19 dBi with better than 22 dB of return loss and 80% radiation efficiency for the frequency range of 67–85 GHz. Summary This article demonstrates a novel type of series‐fed planar antenna array for a W‐band (70 GHz) application. The proposed architecture is a 5‐element antenna array with 10 numbers of gap‐coupled parasitic patches in microstrip configuration over a thin, flexible and bio‐compatible substrate named LCP (liquid crystal polymer). A detailed design methodology with all fabrication constraints has been elaborated on here. Full wave analysis of the whole structure has been carried out in the FEM‐based 3D electromagnetic (EM) solver ANSYS HFSS Suite V.19.2. Parametric simulations were studied to achieve the optimized values of all design parameters. Further, an empirical electrical equivalent circuit model is proposed for the antenna array, and it was validated with the simulation results obtained from the FEM solver. Two prototypes have been fabricated, and measurements were carried out to fetch all the designed antenna parameters. The proto version of the antenna offers peak directive gain of about 19 dBi with better than 22 dB of return loss and 80% radiation efficiency for the frequency range of 67–85 GHz. Experimental and simulated results closely match each other. Small deviations are attributed to practical imperfections incurred by fabrication tolerances, measurement inaccuracies, testing, assembly‐related issues and so forth. Finally, the current research work is compared with the recently reported literature.
telecommunications,engineering, electrical & electronic