Surface-energy-driven Abnormal Grain Growth in Cu and Ag Films

F Ma,JM Zhang,KW Xu
DOI: https://doi.org/10.1016/j.apsusc.2004.07.068
IF: 6.7
2005-01-01
Applied Surface Science
Abstract:A comparative investigation has been made for Cu and Ag films in three states (as-deposited, attaching films after annealing, and free-standing films after annealing) by XRD and TEM. XRD patterns show that, after annealing at 300°C for 2.5h, (111) peak increased obviously in both free-standing Cu and Ag films, on the contrary, (200) and (220) peak increased obviously in attaching films. In addition, a (111)-oriented abnormal large grain was observed in both free-standing Cu and Ag films with TEM, while (100) and (110)-oriented abnormal large grains appeared in attaching Cu films and a (21l)-oriented abnormal grain appeared in attaching Ag films. The experimental results have been explained satisfactorily by the minimizations of surface energy and strain energy.
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