Appliance and Analysis on Technique of Module Liquid Cooling

刘轶斌,王文,时刚

DOI: https://doi.org/10.3969/j.issn.1000-3428.2008.z1.062

2008-01-01

Abstract:With the rapid development of electronic technology,their power density are significantly increased,and their physical dimension are smaller,which lead to higher temperature environment affecting the performance of themselves.More effective heat control is required.Therefore,it is the key technique in the packing and fabricating process that effectively solving the problem of heat dissipation in electronic components.The paper sums up the character of liquid cooling,designs the cold plates with different channel,also makes the actual application and analysis.