Abstract:In a recent study of diffusional creep in polycrystalline thin films deposited on substrates, we have discovered a new class of defects called the grain boundary diffusion wedges (Gao et al., Acta Mat. 47, pp. 2865–2878, 1999). These diffusion wedges are formed by stress driven mass transport between the free surface of the film and the grain boundaries during the process of substrate-constrained grain boundary diffusion. The mathematical modeling involves solution of integro-differential equations representing a strong coupling between elasticity and diffusion. The solution can be decomposed into diffusional eigenmodes reminiscent of crack-like opening displacement along the grain boundary which leads to a singular stress field at the root of the grain boundary. We find that the theoretical analysis successfully explains the difference between the mechanical behaviors of passivated and unpassivated copper films during thermal cycling on a silicon substrate. An important implication of our theoretical analysis is that dislocations with Burgers vector parallel to the interface can be nucleated at the root of the grain boundary. This is a new dislocation mechanism in thin films which contrasts to the well known Mathews-Freund-Nix mechanism of threading dislocation propagation. Recent TEM experiments at the Max Planck Institute for Metals Research have shown that, while threading dislocations dominate in passivated metal films, parallel glide dislocations begin to dominate in unpassivated copper films with thickness below 400 nm. This is consistent with our theoretical predictions. We have developed large scale molecular dynamics simulations of grain boundary diffusion wedges to clarify the nucleation mechanisms of parallel glide in thin films. Such atomic scale simulations of thin film diffusion not only show results which are consistent with both continuum theoretical and experimental studies, but also revealed the atomic processes of dislocation nucleation, climb, glide and storage in grain boundaries. The study should have far reaching implications for modeling deformation and diffusion in micro- and nanostructured materials.

A Simplified Model for Cavity Growth along a Grain-Boundary by Coupled Surface and Grain-Boundary Diffusion

Coupled Grain Boundary and Surface Diffusion in A Polycrystalline Thin Film Constrained by Substrate

A coupled model of diffusional creep of polycrystalline solids based on climb of dislocations at grain boundaries

Coupled surface diffusion and mean curvature motion: An axisymmetric system with two grains and a hole

A New Formulation of Coupling and Sliding Motions of Grain Boundaries Based on Dislocation Structure

Monte-carlo modeling for grain growth process in Vapor-Liquid-Solid phase sintered materials

Constrained Grain Boundary Diffusion in Thin Copper Films

Motion of grain boundaries incorporating dislocation structure

Direct Coupling of Free Diffusion Models to Microscopic Models of Confined Crystal Growth and Dissolution

Monte-Carlo simulation of grain growth in Vapor-Liquid-Solid phase sintered material

Modeling of cavity nucleation, early‐stage growth, and sintering in polycrystal under creep–fatigue interaction

An experimentally informed continuum grain boundary model

Why is Grain Growth Not Curvature Flow?

A unified variational model for grain boundary dynamics incorporating microscopic structure

A Three-Dimensional Continuum Simulation Method for Grain Boundary Motion Incorporating Dislocation Structure

A model for the sintering of spherical particles of different sizes by solid state diffusion

Phase-field simulations of grain boundary grooving under diffusive-convective conditions

A Model for Grain Boundary Thermodynamics

A Study of Strain-Driven Nucleation and Extension of Deformed Grain: Phase Field Crystal and Continuum Modeling

Exact Solution of Integro-Differential Equations of Diffusion along a Grain Boundary