Motion of an elliptical void in interconnects embedded in matrix under gradient stress field

H.J. Xie,X. Wang,S. Li,Z. Li
DOI: https://doi.org/10.1016/j.tsf.2011.02.057
IF: 2.1
2011-01-01
Thin Solid Films
Abstract:We present an analytical solution for the motion of an elliptical void in representative interconnects embedded in a matrix with different line aspect (volume) ratio, under gradient stress field. An orthotropic elastic model is used to represent representative interconnects embedded in a matrix. The effects of stress gradient, stress states, an equivalent void size, the orthotropic material characteristic, and the shape parameter of the void on the motion velocity of an elliptical void are described and discussed.
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