A Moving ModeⅢ Crack at Interface Between Two Different Functionally Piezoelectric Piezomagnetic Materials

Lu Wanshun,Li Xing,Guo Yubin
DOI: https://doi.org/10.3969/j.issn.0253-2328.2009.03.007
2009-01-01
Abstract:A moving mode Ⅲ crack at the interface between two different functionally piezoelectric piezomagnetic materials is studied in the paper.Based on the assumption that the effect of the crack surface overlapping very near the crack tips is negligible,Fourier transforms are used to reduce the problem to the solution of a pair of dual integral equations,which are then reduced to a Fredholm integral equation of second kind by Copson-Sih method.Finally,the influences of graded parameter,the moving velocity of the crack and geometrical sizeon dynamic stress intensity factor are analyzed.
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