One-Step Multicomponent Encapsulation by Compound-Fluidic Electrospray

Hongyan Chen,Yong Zhao,Yanlin Song,Lei Jiang
DOI: https://doi.org/10.1021/ja801803x
IF: 15
2008-01-01
Journal of the American Chemical Society
Abstract:Fabrication of sophisticated or smart materials often needs controlled integrating multiple components into a single capsule. Most of conventional microencapsulation strategies merely envelop one content into a shell every time. We report a compound-fluidic electrospray method could one-step enclose multiple components into a single microcapsule without contact. The as-prepared microcapsules have multiple compartments inside, in each of which different content can be addressably loaded. This approach gives flexibility for generating diverse microcapsules that could one-step integrate different active components in microscopic domain free of contact, which may find potential applications in multicomponent drug delivery, microreactors and others.
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