3D-IRFPA Technology

Lu Wengao,Zhang Min,Wang Guannan,Zhu Yunhui,Jin Yufeng
DOI: https://doi.org/10.3969/j.issn.1005-488X.2013.02.001
2013-01-01
Abstract:As the pixel area is smaller,the array size is larger and the frame rate is higher,integrated technology has become a bottleneck for the traditional IRFPA.Through stacking chips,the 3D-IRFPA integrates with A/D convertor,DSP and memory so that it breaks the bottleneck brought on by pixel area,array size and frame rate and leads to more powerful function and higher performance.This paper presents the structure principle,the advantages,challenges and state of art of 3D-IRFPA.
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