Experimental Study on Formability of Bulk Metallic Glass As Mold for Microstructure Replication

Lin Mei,Jingbei Liu,Yongjiang Huang,Jie Lin,Jun Shen,Jiubin Tan,Peng Jin
DOI: https://doi.org/10.1016/j.mee.2012.07.065
IF: 2.3
2012-01-01
Microelectronic Engineering
Abstract:La"6"2Al"1"4Cu"1"2Ni"1"2BMG is introduced as a substitute for silicon which was widely used as mold material for nanofabrication. For the purpose of precise microstructure replication and complete filling, effects of various imprint parameters, including imprint temperature, imprint time and compression load, on formability of La"6"2Al"1"4Cu"1"2Ni"1"2BMG are studied and discussed. Scanning electron microscope images and results of thermal analysis are used to characterize the filling effect of La"6"2Al"1"4Cu"1"2Ni"1"2BMG. In particular, correlations between time and thermodynamic properties are presented. Despite of its high viscosity at crystallization temperature and its narrow supercooled liquid region, La"6"2Al"1"4Cu"1"2Ni"1"2BMG is proved to be a durable and promising material which can precisely replicate the patterns of silicon mold and then transfer its own patterns on Ce"6"9Al"1"0Cu"2"0Co"1BMG and PMMA.
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