Button shear testing for adhesion measurements of 2D materials

Josef Schätz,Navin Nayi,Jonas Weber,Christoph Metzke,Sebastian Lukas,Jürgen Walter,Tim Schaffus,Fabian Streb,Eros Reato,Agata Piacentini,Annika Grundmann,Holger Kalisch,Michael Heuken,Andrei Vescan,Stephan Pindl,Max C. Lemme

DOI: https://doi.org/10.1038/s41467-024-46136-8

IF: 16.6

2024-03-18

Nature Communications

Abstract:Abstract Two-dimensional (2D) materials are considered for numerous applications in microelectronics, although several challenges remain when integrating them into functional devices. Weak adhesion is one of them, caused by their chemical inertness. Quantifying the adhesion of 2D materials on three-dimensional surfaces is, therefore, an essential step toward reliable 2D device integration. To this end, button shear testing is proposed and demonstrated as a method for evaluating the adhesion of 2D materials with the examples of graphene, hexagonal boron nitride (hBN), molybdenum disulfide, and tungsten diselenide on silicon dioxide and silicon nitride substrates. We propose a fabrication process flow for polymer buttons on the 2D materials and establish suitable button dimensions and testing shear speeds. We show with our quantitative data that low substrate roughness and oxygen plasma treatments on the substrates before 2D material transfer result in higher shear strengths. Thermal annealing increases the adhesion of hBN on silicon dioxide and correlates with the thermal interface resistance between these materials. This establishes button shear testing as a reliable and repeatable method for quantifying the adhesion of 2D materials.

multidisciplinary sciences

What problem does this paper attempt to address?

The paper primarily addresses the issue of quantifying the adhesion forces of two-dimensional (2D) materials in microelectronic device applications. Due to the weak adhesion caused by the chemical inertness of 2D materials, they face challenges in functional device integration. To reliably integrate 2D materials, quantifying their adhesion on three-dimensional surfaces becomes a critical step.

The paper proposes and demonstrates the button shear test as a method to evaluate the adhesion of 2D materials such as graphene, hexagonal boron nitride (hBN), molybdenum disulfide, and tungsten selenide on silicon dioxide and silicon nitride substrates. Researchers developed a polymer button preparation process for 2D materials and determined the appropriate button size and shear testing speed. Through quantitative data analysis, it was found that low substrate roughness and oxygen plasma pretreatment can improve shear strength. Thermal annealing increased the adhesion of hBN on silicon dioxide and was associated with the thermal interface resistance between these materials.

The button shear test is thus established as a reliable and repeatable method for measuring the adhesion of 2D materials, applicable to different 2D material and substrate combinations, as well as for evaluating the impact of sample treatment on adhesion. Additionally, the paper discusses the optimization of test parameters, the influence of shear speed, and the adhesion performance analysis of different 2D materials such as graphene, hBN, molybdenum disulfide, and tungsten selenide, including the effects of thermal annealing and the revelation of non-uniformity. It emphasizes the potential value of this method in optimizing the deposition, transfer, and subsequent device manufacturing processes of 2D materials.