Thermal-deformation coupling in thermal network for transient analysis of spindle-bearing system

Ke Yan,Jun Hong,Jinhua Zhang,Wei Mi,Wenwu Wu
DOI: https://doi.org/10.1016/j.ijthermalsci.2015.12.007
IF: 4.779
2016-06-01
International Journal of Thermal Sciences
Abstract:Transient analysis by thermal network method for complex structures like the spindle-bearing system is essential but insufficient. In this paper, the network approach was developed for spindle transient analysis in consideration of thermal-structure interaction. Firstly, the radial and axial deformation of spindle system during assembling process, deformation by thermal extension and centrifugal effect were all obtained. Then the transient analysis was deduced based on traditional steady model, the thermal-deformation coupling and some other time-varying parameters. Experiment results indicate that temperature by steady model is of large deviation, while by the transient model is much more accurate. Finally, the temperature rising curves, the balance time of the spindle system and temperature rise feature for continuous working conditions were all achieved and discussed.
engineering, mechanical,thermodynamics
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