Abstract:<p>The solder paste printing (SPP) is a critical procedure in a surface mount technology (SMT) based assembly line, which is one of the major attributes to the defect of the printed circuit boards (PCBs). The quality of SPP is influenced by multiple factors, such as the squeegee speed, pressure, the stencil separation speed, cleaning frequency, and cleaning profile. During printing, the printer environment is dynamically varying due to the physical change of solder paste, which can result in a dynamic variation of the relationships between the printing results and the influential factors. To reduce the printing defects, it is critical to understand such dynamic relationships. This research focuses on determining the printing performance during printing by implementing a wavelet filtering-based temporal recurrent neural network. To reduce the noise factor in the solder paste inspection (SPI) data, this research applies a three-dimensional dual-tree complex wavelet transformation for low-pass noise filtering and signal reconstruction. A recurrent neural network is utilized to model the performance prediction with low noise interference. Both printing sequence and process setting information are considered in the proposed recurrent network model. The proposed approach is validated using practical dataset and compared with other commonly used data mining approaches. The results show that the proposed wavelet-based multi-dimensional temporal recurrent neural network can effectively predict the printing process performance and can be a high potential approach in reducing the defects and controlling cleaning frequency. The proposed model is expected to advance the current research in the application of smart manufacturing in surface mount technology.</p>

What problem does this paper attempt to address?

The paper primarily focuses on addressing a key issue in the Surface Mount Technology (SMT) solder paste printing (SPP) process—how to optimize and control the stencil cleaning cycle during the printing process to reduce printing defects and improve overall production quality and efficiency. Specifically, the paper addresses the following core issues: 1. **Understanding Dynamic Relationships**: During the printing process, the state of the solder paste changes over time, leading to dynamic changes in the relationship between printing results and influencing factors. Therefore, understanding these dynamic relationships is crucial for reducing printing defects. 2. **Reducing Noise Interference**: The actual collected Solder Paste Inspection (SPI) data usually contains noise, which affects the accuracy of data analysis. Therefore, a method is needed to reduce noise interference in this data. 3. **Predicting Printing Performance**: Using low-noise interference data, construct a model that can predict the performance of the printing process. This includes considering printing sequence information and process setting information. 4. **Determining the Ideal Cleaning Cycle**: Based on the results of printing performance predictions, determine the most suitable stencil cleaning cycle to achieve the goal of reducing defects and controlling cleaning frequency. To achieve the above goals, the authors propose a Wavelet-based Multi-Dimensional Temporal Recurrent Neural Network. This method first applies the 3D Dual-Tree Complex Wavelet Transformation (DTCWT) to reduce noise in the SPI data and reconstruct the signal. Then, a Recurrent Neural Network (RNN), particularly a Long Short-Term Memory (LSTM) network, is used to model and predict the performance of the printing process. This method not only considers printing sequence information but also process setting information, thereby improving the accuracy and reliability of cleaning cycle decisions. Experimental results show that the proposed model can effectively predict printing process performance and is expected to become an efficient method for reducing defects and controlling cleaning frequency.

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