TSV based 3D stacked ICs: Opportunities and challenges

S. Hamdioui
DOI: https://doi.org/10.1109/DDECS.2012.6219008
2012-04-18
Abstract:The industry is preparing itself for three-dimensional stacked ICs (3D-SICs), vertically interconnected by means of Through-Silicon Via's (TSVs). 3D-SIC is an emerging technology that promises huge advantages such as heterogeneous integration with higher performance and lower power dissipation at a smaller footprint. However, for 3D integration to become a viable product approach, many challenges have to be solved including design, manufacturing and test.
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