Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS

M. Lapisa,G. Stemme,F. Niklaus
DOI: https://doi.org/10.1109/JSTQE.2010.2093570
IF: 4.9
2011-01-13
IEEE Journal of Selected Topics in Quantum Electronics
Abstract:Wafer-level heterogeneous integration technologies for microoptoelectromechanical systems (MOEMS), microelectromechanical systems (MEMS), and nanoelectromechanical systems (NEMS) enable the combination of dissimilar classes of materials and components into single systems. Thus, high-performance materials and subsystems can be combined in ways that would otherwise not be possible, and thereby forming complex and highly integrated micro- or nanosystems. Examples include the integration of high-performance optical, electrical or mechanical materials such as monocrystalline silicon, graphene or III-V materials with integrated electronic circuits. In this paper the state-of-the-art of wafer-level heterogeneous integration technologies suitable for MOEMS, MEMS, and NEMS devices are reviewed. Various heterogeneous MOEMS, MEMS, and NEMS devices that have been described in literature are presented.
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