Sweep Rate and Concentration Effects on Metastable Structures Formed in the Underpotential Deposition of Silver on Pt(111)

D. Taylor,H. Abruña
DOI: https://doi.org/10.21236/ada275369
Abstract:INTRODUCTION The process of underpotential deposition (UPD) of metals on foreign metal substrates continues to be the subject of intense investigation [1] through the use of electrochemical (especially cyclic voltammetry) methods, surface spectroscopic techniques [2] and most recently scanned probe microscopies [3]. The use of electrochemical techniques such as cyclic voltammetry provides a means of probing the energetics of the system and also allows for an indirect characterization of the processes taking place. Features in the voltammetry can be sensitive to the mechanism of deposition and as a result, can provide information regarding o• structural transitions as well as interactions between the surface and the UPD layer. The e.,d $ underpotential deposition of silver on polycrystalline as well as single crystal Pt(1 11) surfaces is .0 •, one system that has received considerable attention [4-161. ! !a 1" 0•There are several parameters involved in the underpotential deposition of metals which 1 1 S•. may affect the growth mechanism of the metal overlayer. Of particular importance are the o , solution concentration of the metal to be deposited and the rate of potential sweep. As the concentration is varied, the mass transport of the species to the electrode is changed and this may affect the kinetics and/or the mechanism of the deposition process. This may lead to the formation of different surface structures at different concentrations. Changes in voltammetric features, which arise as the scan rate of the experiment is varied, typically reflect kinetic limitations in the growth of the deposited layer. Although the importance of these parameters is
What problem does this paper attempt to address?