Effect of low power Er:YAG laser irradiation of CAD-CAM resin-based composites on resin bonding

Yukari Odagiri,Taku Horie,Kazuho Inoue,Keiko Sakuma,Akimasa Tsujimoto,Franklin Garcia-Godoy,Morioki Fujitani
Abstract:Purpose: To investigate the effect of painless low-power Er:YAG laser irradiation of conventional and polymer-infiltrated ceramic network (PICN) type CAD-CAM resin-based composites (RBCs) on resin bonding. Methods: An Er:YAG laser system, phosphoric acid etchant, universal adhesive, RBC, and two types of CAD-CAM RBC block were used. Microtensile bond strength, fracture mode, scanning electron microscopy (SEM) observations of bonding interfaces and CAD-CAM surfaces, and surface roughness of ground and pretreated surfaces were investigated. As pretreatment methods, low-power Er:YAG laser irradiation and air-abrasion with alumina particles were used. Results: The effect of low-power Er:YAG laser irradiation of CAD-CAM RBCs on bonding to repair resin varied depending on the type of CAD-CAM RBCs. Clinical significance: The low-power Er:YAG laser irradiation of the conventional CAD-CAM RBCs was shown to be effective as a surface pretreatment for resin bonding, while the laser irradiation of PICN-type CAD-CAM RBCs was not effective.
What problem does this paper attempt to address?