Influence of underfill materials on the reliability of coreless flip chip package

Chun-Chih Chuang,Tsung-Fu Yang,J. Juang,Yin-Po Hung,C. Zhan,Yu-Min Lin,Ching-Tsung Lin,P. Chang,Tao-Chih Chang
DOI: https://doi.org/10.1016/j.microrel.2008.09.005
2008-11-01
Abstract:
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