Voltage and Return Plane Bounce Affecting Digital Components Using Different Printed Circuit Board Edge Termination Methodologies

M. Montrose
DOI: https://doi.org/10.1109/TEMC.2011.2141997
2011-06-20
Abstract:This paper illustrates effects of board edge termination related to development of either voltage or return plane bounce exceeding operational margin levels of digital components at multiple locations within a printed circuit board (PCB). We study an actual problem encountered by design engineers using a worse-case configuration. This paper also explains how power and/or return bounce is developed. Lack of optimal plane termination at the physical edges of a PCB will exacerbate plane bounce. In addition, a solution that prevents this problem is provided in Section VIII.
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