Solution-shearing of dielectric polymer with high thermal conductivity and electric insulation

Zheng Li,Lu An,Saurabh Khuje,Jingye Tan,Yong Hu,Yulong Huang,Donald Petit,Danial Faghihi,Jian Yu,Shenqiang Ren

DOI: https://doi.org/10.1126/sciadv.abi7410

IF: 13.6

2021-10-01

Science Advances

Abstract:We obtain a promising thermal conductive electric insulation material by gel shearing of polyethylene.

multidisciplinary sciences

What problem does this paper attempt to address?

Significantly enhancing the discharge efficiency of sandwich-structured polymer dielectrics at elevated temperature by building carrier blocking interface

Yujuan Niu,Jiufeng Dong,Yifei He,Xinwei Xu,Shuai Li,Kai Wu,Qing Wang,Hong Wang

DOI: https://doi.org/10.1016/j.nanoen.2022.107215

IF: 17.6

2022-06-01

Nano Energy

Abstract:Dielectric materials with high power densities have irreplaceable advantages in electrical energy storage. However, conventional polymer dielectrics are unable to meet the ever-increasing power demands in harsh environments. Here we report a high-temperature dielectric based on judiciously designed all-polymer sandwiched films consisting of polyimide (PI) and polyetherimides (PEIs). Due to the swelling effect of PEIs solution on the PI surface, it built a clear and complete interface with a gradient change molecular stacking structure between the PEIs and PI layers in the sandwiched film, resulting in an increase in the density of deep traps and the accumulation of space charges in the interface. It is found via direct experimental evidence that the high-field electrical conduction at high temperatures can be effectively suppressed. The sandwiched film exhibits excellent comprehensive capacitive performance even at 200 °C, e.g. a discharged energy density of 2.0 J cm−3 and a charge-discharge efficiency of 92% at 300 MV m−1. Along with facile technology compatible with roll-to-roll processing, this work also opens a new avenue to high-energy-density all-polymer dielectric for high-temperature applications by building interface carrier barrier.

materials science, multidisciplinary,chemistry, physical,physics, applied,nanoscience & nanotechnology
Dielectric polymer composites with ultra-high thermal conductivity and low dielectric loss

Xiangyan Yu,Muhammad Rehan Bhatti,Xintong Ren,Pietro Steiner,Federico Di Sacco,Ming Dong,Han Zhang,Dimitrios Papageorgiou,Giuseppe Portale,Coskun Kocabas,Cees W.M. Bastiaansen,Mike Reece,Haixue Yan,Emiliano Bilotti

DOI: https://doi.org/10.1016/j.compscitech.2022.109695

IF: 9.1

2022-10-20

Composites Science and Technology

Abstract:Polymer based dielectric materials with simultaneously high thermal conductivity and low dielectric loss are highly desirable in various applications like energy storage, thermal management and electronic packaging. Polymer dielectrics generally benefit from good electrical insulation, high breakdown strength, high toughness and low density but suffer from very low thermal conductivity (0.1–0.5 W m −1 K −1). Herein we propose a new strategy to overcome this compromise; solid-state drawing of ultra-high molecular weight polyethylene (UHMWPE) films doped with a small amount of nanodiamonds (NDs). The resulting orientation of UHMWPE macromolecules and the nanofiller significantly improves the thermal conductivity along the stretching direction, while the dodecane surface functionalization of the NDs endows a robust interface between the matrix and filler, which minimizes the thermal resistance and dielectric loss. Our composites film (2 wt% NDs) shows an ultra-high thermal conductivity of 60 W m −1 K −1 in the drawing direction and very low dielectric loss, both at low and high electric field. More generally, herein we demonstrates that the interfaces introduced by the nanofillers do not necessarily cause an increase in dielectric loss at high electric field and a decrease in thermal conductivity, providing a new direction for the design of novel polymer based dielectric and functional materials.

materials science, composites
Scalable self-assembly interfacial engineering for high-temperature dielectric energy storage

Chao Wu,Anna Marie LaChance,Mohamadreza Arab Baferani,Kuangyu Shen,Zongze Li,Zaili Hou,Ningzhen Wang,Yifei Wang,Luyi Sun,Yang Cao

DOI: https://doi.org/10.1016/j.isci.2022.104601

IF: 5.8

2022-07-01

iScience

Abstract:Flexible polymer dielectrics which can function well at elevated temperatures continue to be significant in harsh condition energy storage. However, state-of-the-art high-temperature polymers traditionally designed with conjugated structures for better thermal stability have compromised bandgaps and charge injection barriers. Here, we demonstrate a self-assembled polyvinyl alcohol (PVA)/montmorillonite (MMT) coating to impede charge carriers injecting into the polyimide (PI) polymer film. The anisotropic conductivity of the 2D nanolayered coating further dissipates the energy of charges through tortuous injection pathways. With the coating, high field pre-breakdown conduction measurement and space-charge profiling of PI films reveal a clear shifting of the dominant mode of conduction from the bulk-limited hopping to Schottky-injection limited conduction. The coating thus imparts PI films with a significantly suppressed electrical conduction (∼10×), and substantially improved discharge efficiency (7×) and energy density (2.7×) at 150°C. The facile and scalable flow-induced fabrication unleash enormous applications for harsh condition electrification.

multidisciplinary sciences
Improving the Rotational Freedom of Polyetherimide: Enhancement of the Dielectric Properties of a Commodity High-Temperature Polymer Using a Structural Defect

Abdullah Alamri,Chao Wu,Ankit Mishra,Lihua Chen,Zongze Li,Ajinkya Deshmukh,Jierui Zhou,Omer Yassin,Rampi Ramprasad,Priya Vashishta,Yang Cao,Gregory Sotzing

DOI: https://doi.org/10.1021/acs.chemmater.2c01441

IF: 10.508

2022-07-12

Chemistry of Materials

Abstract:Dielectric polymers that can withstand harsh conditions of simultaneous high electric field and elevated temperature are widely used in electrical and electronic systems. However, traditionally, the thermal stability of polymers is engineered based on highly conjugated aromatic molecular structures, giving rise to soring charge transport and thus poor charge–discharge efficiency under concurrent high electric field and elevated temperature. Here, we locally improved the rotational flexibility of the phenylenediamine linkage structure in polyetherimide (PEI) to decouple the conjugation of the organic molecule. p-Phenylenediamine (5 mol %) as a low-energy rotation repeat unit within PEI significantly optimized its dielectric properties, exhibiting substantially suppressed electrical conduction (more than 1 order of magnitude lower) and polarization loss (<1%). The new PEI has a largely improved charge–discharge efficiency of 91% at 400 MV/m 200 °C, outperforming the best-reported polymer-based dielectrics without any modification of the cost of goods. The high-throughput facile processing of the new PEI provides a potential candidate for energy storage applications under elevated temperatures. This work unveils a scalable approach to exploring polymer dielectrics by introducing a small amount of local structural modifications.

materials science, multidisciplinary,chemistry, physical
Enhanced thermal conductivity in copolymerized polyimide

Bohai Liu,Yu Zhou,Lan Dong,Qinghua Lu,Xiangfan Xu

DOI: https://doi.org/10.1016/j.isci.2022.105451

IF: 5.8

2022-11-01

iScience

Abstract:From flexible electronics and multifunctional textiles to artificial tissues, polymers penetrate nearly every aspect of modern technology. High thermal conductivity of polymers is often required in their applications, where heat dissipation is crucial to maintain product reliability and functionality. However, the intrinsic thermal conductivity of bulk polymers is largely hindered by the randomly coiled and entangled chain conformation. Here, we report a copolymerization strategy that can simultaneously manipulate the intrachain and interchain hopping and increase the thermal conductivity of linear copolymerized polyimide (PI) to three times higher than that of pure PI at a low-level introduction of 2,4,5,7-tetraamino-1,8-dihydroxyanthracene-9,10-dione (10%). In addition, the large-scale copolymerized PI films display thermal stability after annealing. These remarkable results allow bulk PI to be a potential candidate for thermal management, and this copolymerization method may benefit future synthesis of interfacial thermal materials.

multidisciplinary sciences
High-temperature dielectric with excellent capacitive performance enabled by rationally designed traps in blends

Zhonghua Zhao,Shuo Zhang,Mingru Li,Yang Feng,Liuqing Yang,Shengtao Li

DOI: https://doi.org/10.1063/5.0208131

IF: 2.877

2024-05-17

Journal of Applied Physics

Abstract:Polymer dielectrics with excellent capacitive performance are urgently needed in advanced electrical and electronic systems. However, due to the dramatic increase in the conduction loss, the energy density and efficiency of polymers degrade severely at elevated temperatures, limiting their application in harsh environments up to 150 °C. Herein, an all-organic polyurea (PU)/polyetherimide (PEI) blend film is designed to prepare high-temperature polymer dielectric. It is found that carrier traps can be introduced by blending, and the hydrogen bond between PU and PEI increases the trap depth, leading to suppressed leakage current and enhanced breakdown strength, thus improving the energy storage performance. PU/30%PEI exhibits a high discharged energy density of ∼3.74 J/cm3 with an efficiency higher than 90% at 150 °C, which is 78% and 70% higher than pristine PU and PEI, respectively. This work provides a facile strategy to improve the energy storage performance of polymer dielectrics by introducing deep traps through blending.

physics, applied
Highly efficient thermal conductivity of polyarylene ether nitrile composites via the introduction of hybrid fillers and tailored cross-linked structure

Liang He,Yu Zheng,Xiaoling Xu,Xiaobo Liu,Lifen Tong

DOI: https://doi.org/10.1016/j.polymer.2024.127245

IF: 4.6

2024-06-05

Polymer

Abstract:Polymer dielectrics with high thermal conductivity (λ) and excellent insulating properties are of interest in miniaturized and integrated electronic devices. However, most polymers are unable to fulfill this need due to their inherent structure. In this work, a polymer alloy with balanced thermal conductive and dielectric properties was successfully prepared by polyarylene ether nitrile(PEN), bisphthalonitrile-microsphere@boron nitride nanosheets(Bm@BNNS), and silicon carbide whisker (SiCws) at different scales. Specifically, introduction of Bm@BNNS fillers with core-shell structure into PEN resins results in heterogeneous interfaces, which effectively reduces the agglomeration and dosage of BNNS and synergistically improves the λ and dielectric performance. Besides, it has high breakdown strength (E b ) and high energy storage density (242.26kV/mm, 1.66J/cm 3 ) when filled with only 4.37 vol% BNNS compared to pure PEN. Furthermore, effects of one-dimensional SiCws at different scales on formation of heat-conduction pathways and electrical insulation properties of PEN/Bm@BNNS composites were investigated. The findings display that PEN/Bm@BNNS/SiCws composites with large size SiCws (7.81 vol%) achieved a high λ of 2.376 W/m.K, which was 135.24% and 87.09% higher than pure PEN and PEN/Bm@BNNS composites, respectively. Thus, the thermal conductive pathways are constructed by line-plate structure (SiCws-BNNS), and insulating performance primarily on the core-shell structure (Bm@BNNS). Besides, the novel PEN/Bm@BNNS/SiCws hybrid materials are together with a low coefficient of thermal expansion of 38-89 ppm/°C and high T g of 220 °C. Thus, it gives a promising insight to achieve highly λ polymer-based insulating film materials used for high-temperature-resistant fields.

polymer science
Inhibition conduction loss for distinct improvement of energy storage density over a broad temperature range in polyetherimide-based composite films

Hanxi Chen,Zhongbin Pan,Yu Cheng,Xiangping Ding,Zhicheng Li,Xu Fan,Jinjun Liu,Peng Li,Jinhong Yu,Jiwei Zhai

DOI: https://doi.org/10.1016/j.polymer.2022.125572

IF: 4.6

2022-12-01

Polymer

Abstract:The exploration of high-energy-density polymer dielectrics that can operate stably under high temperatures is of great significance in order to meet the growing needs for modern high-power electronics. However, the drastically deteriorated capacitive performances brought by the inevitable conduction loss at elevated temperature grievously hinder their application in extreme circumstances. Herein, a class of sandwich-structured dielectric nanocomposites capitalizing on binary wide-bandgap nanofillers is reported. The synergy of wide bandgap Al 2 O 3 nanoparticles and hydroxyl-modified BNNSs can build higher interfacial barrier to efficiently depress the thermionic charge injection and carrier transport in dielectrics, yielding a substantially inhibited electrical conduction of the composites under elevated temperature. Indeed, the resulting sandwich-structured polymer composites deliver first-class-level discharged energy density ( U d ) of ∼2.23 J/cm 3 with efficiency ( η ) > 90% even under the ultra-high temperature of 200 °C, which is by far the current free-standing high-temperature dielectric polymer and polymer-based composites reported to date. Together with remarkable dielectric stability over a wide temperature and frequency range and outstanding cyclability, this contribution puts forward an efficient approach to groping for scalable high-temperature dielectric polymer nanocomposites for advanced electrical energy storage.

polymer science
High Thermal Conductivity Polyelectrolyte Nanocomposite Electrical Insulation Thin Films

Ethan T. Iverson,Hudson Legendre,Sourav Chakravarty,Shiyu Zhang,Sarah G. Fisher,Dallin L. Smith,Kendra Schmieg,Yanxiu Ge,Dion S. Antao,Patrick J. Shamberger,Jaime C. Grunlan

DOI: https://doi.org/10.1002/adfm.202420355

IF: 19

2024-11-28

Advanced Functional Materials

Abstract:A polyelectrolyte‐based nanocomposite is investigated as a thermally conductive dielectric material. Due to the jagged deposition of the platelets through the thickness of the film, a through‐plane thermal conductivity of 1.87+/−0.03 W m−1 K−1 is obtained without sacrificing the polymer matrix's high breakdown strength (152 kV mm−1). The nanocomposite also noticeably decreases the operation temperature of a simulated motor. High‐power electronics require thin, conformal insulation that resists dielectric breakdown, while promoting removal of heat from the device. Recently, polyelectrolytes have shown promise in creating dielectric thin films, but their thermal conductivity remains relatively low (<1 W m−1 K−1). In this work, the layer‐by‐layer (LbL) assembly of polyethylenimine, mica clay, poly(acrylic acid), and hexagonal boron nitride is exploited to create a thin film dielectric material with relatively high thermal conductivity (through‐plane thermal conductivity of 1.87 ± 0.03 W m−1 K−1) and strong electrical insulation (breakdown strength of 152 kV mm−1). High thermal conductivity is obtained due to mica and hexagonal boron nitride nanoplatelets stretching through multiple layers. The performance benefits of this nanocomposite are demonstrated with a partial motor, where the nanocomposite greatly reduces the peak temperature of the motor when compared to state‐of‐the‐art polyimide insulation. This remarkable combination of thermal conductivity and dielectric breakdown strength represents a significant advancement in the electrical and thermal protection of high voltage devices.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
Thermally activated dynamic bonding network for enhancing high-temperature energy storage performance of PEI-based dielectrics

Jialong Li,Xiaoxu Liu,Bingshun Huang,Dongyang Chen,Zhaoru Chen,Yanpeng Li,Yu Feng,Jinghua Yin,Haozhe Yi,Taoqi Li

DOI: https://doi.org/10.1039/d3mh00499f

IF: 13.3

2023-06-09

Materials Horizons

Abstract:To address the paradox of mutually exclusive confusions between the breakdown strength and polarization of the polymer-based composites at high-temperature, a dynamic multisite bonding network is constructed by connecting the -NH2 groups of polyetherimide (PEI) and Zn2+ in metal-organic frameworks (MOFs). Owing to the multisite bonding network is dynamically stable at high-temperature, the composites possess high breakdown strength of 588.1 MV m-1 at 150 °C, which is 85.2% higher than that of PEI. Importantly, the multisite bonding network could be thermally activated at high-temperature to generate extra polarization, which is because the Zn-N coordination bonds were evenly stretched. At similar electric field, the composites show higher energy storage density at high-temperature compared with that at room temperature, and present excellent cycling stability even with increased electrode size. Finally, the reversible stretching of the multisite bonding network against temperature variation are confirmed by the in-situ X-ray absorption fine structure (XAFS) and theoretical calculation. This work presents a pioneering example of constructing self-adaptive polymer dielectrics in extreme environments, which might be a potential method for designing recyclable polymer-based capacitive dielectrics.

materials science, multidisciplinary,chemistry
Evaluation of the Dielectric and Insulating Properties of Newly Synthesized Ethylene/1-Hexene/4-Vinylcyclohexene Terpolymers

Amjad Ali,Khulood Fahad Saud Alabbosh,Ahmad Naveed,Azim Uddin,Yanlin Chen,Tariq Aziz,Jamile Mohammadi Moradian,Muhammad Imran,Lu Yin,Mobashar Hassan,Waqar Ahamad Qureshi,Muhammad Wajid Ullah,Zhiqiang Fan,Li Guo

DOI: https://doi.org/10.1021/acsomega.2c04123

IF: 4.1

2022-01-01

ACS Omega

Abstract:Terpolymerizations of newly synthesized ethylene (E), vinylcyclohexene (VCH), and 1-hexene were carried out with symmetrical metallocene catalysts rac-Me2Si(2-Me-4-Ph-Ind)2ZrCl2 (catalyst A) and rac-Et(Ind)2ZrCl2 (catalyst B). X-ray diffractometry (XRD), scanning electron microscopy (SEM), differential scanning calorimetry (DSC), high-temperature gel permeation chromatography (GPC), and nuclear magnetic resonance (NMR) spectroscopy were used to evaluate the behavior and microstructure of the polymers. The activity of catalyst B was 1.49 × 106 gm/mmolMt·h), with a T m of 73.45 (°C) and ΔH m of 43.19 (J/g), while catalyst A produced first higher 1-hexene, 19.6 mol %, and VCH contents with a narrow molecular weight distribution (MWD). In previous reports, ethylene propylene monomer dienes (EPDM) had a low content and were used for dielectric and insulating properties with nanomaterials. Second, this paper presents a kind of elastomeric polymers based on E/1-hexene and VCH with a high dielectric constant (k = 6-4) and mechanical properties. In addition, low dielectric loss suggests the suitable application potential of these polymeric materials for the fabrications of capacitors. Also, this work reveals that these polymers can be a better candidate for high-voltage electrical insulation due to their enhanced dielectric, mechanical, and thermal characteristics. To examine the insulating property, the interface characteristics of the polymer were evaluated using electrochemical impedance spectroscopy (EIS) with a frequency range of 1 × 105-0.01 Hz and an amplitude of 5.0 mV. EIS is an effective method to investigate the polymers' interfacial electron transfer characteristics. The EIS Nyquist plot showed high Warburg impedance features in the low-frequency domain with straight lines without a semicircle, suggesting that the property of the polymer owing to the high electrical resistance and poor conductivity for ionic kinetics in the electrolyte may have surpassed that of the semicircle. Although the slope of low frequencies in polymers holding potent exoelectrogenic bacteria (Shewanella oneidensis MR-1) as a charge carrier in the electrolyte could significantly reduce the Warburg resistance, it still could not improve the conductivity, which demonstrated that the external charge supply could not alter the insulating property in the used polymers.
Fully Organic Bulk Polymer with Metallic Thermal Conductivity and Tunable Thermal Pathways

Yongzheng Zhang,Chuxin Lei,Kai Wu,Qiang Fu

DOI: https://doi.org/10.1002/advs.202004821

IF: 15.1

2021-05-24

Advanced Science

Abstract:Electrically insulating polymers are indispensable for electronic and energy applications, but their poor thermal conduction has increasingly become a bottleneck for high-performance devices. Highly drawn low-dimensional polymeric fibers and thin films can exhibit metallic conductivity. Extending this to bulk materials required by real world applications is prohibitive due to the additional interfacial thermal conduction barriers. It is demonstrated that highly aligned ultrahigh molecular weight polyethylene microfibers can be incorporated into a silicone matrix to yield a fully organic bulk polymer composite with a continuous vertical phonon pathway. This leads to a perpendicular thermal conductivity of 38.27 W m−1 K−1, at par with metals and two orders of magnitude higher than other bulk organic polymers. Taking further advantage of the mechanical flexibility of the microfibers, the processing method offers the freedom to tailor heat transfer pathways in a macroscopic 3D space. The material/process opens up opportunities for efficient thermal management in high-performance devices.

materials science, multidisciplinary,nanoscience & nanotechnology,chemistry
Scalable Polyimide‐Organosilicate Hybrid Films for High‐Temperature Capacitive Energy Storage

Jiufeng Dong,Li Li,Peiqi Qiu,Yupeng Pan,Yujuan Niu,Liang Sun,Zizhao Pan,Yuqi Liu,Li Tan,Xinwei Xu,Chen Xu,Guangfu Luo,Qing Wang,Hong Wang

DOI: https://doi.org/10.1002/adma.202211487

IF: 29.4

2023-03-11

Advanced Materials

Abstract:High‐temperature polymer dielectrics have broad application prospects in next‐generation microelectronics and electrical power systems. However, the capacitive energy densities of dielectric polymers at elevated temperatures are severely limited by carrier excitation and transport. Herein, we present a molecular engineering strategy to regulate the bulk‐limited conduction in the polymer by bonding amino polyhedral oligomeric silsesquioxane (NH2‐POSS) with the chain ends of polyimide (PI). Experimental studies and density functional theory (DFT) calculations demonstrate that the terminal group NH2‐POSS with a wide‐bandgap of Eg∼6.6 eV increases the band energy levels of the PI and induces the formation of local deep traps in the hybrid films, which significantly restrains carrier transport. At 200 °C, the hybrid film exhibits concurrently an ultrahigh discharged energy density of 3.45 J·cm−3 and a high gravimetric energy density of 2.74 J·g−1, with the charge‐discharge efficiency >90%, far exceeding those achieved in the dielectric polymers and nearly all other polymer nanocomposites. Moreover, the NH2‐POSS terminated PI film exhibits excellent charge‐discharge cyclability (>50000) and power density (0.39 MW·cm−3) at 200 °C, making it a promising candidate for high‐temperature high‐energy‐density capacitors. This work represents a novel strategy to scalable polymer dielectrics with superior capacitive performance operating in harsh environments. This article is protected by copyright. All rights reserved

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
High-temperature dielectric polymer nanocomposites with interposed montmorillonite nanosheets

Yifei Wang,Zongze Li,Chao Wu,Yang Cao

DOI: https://doi.org/10.1016/j.cej.2020.126093

IF: 15.1

2020-12-01

Chemical Engineering Journal

Abstract:Over the past decades, energy densities have always been considered as the key factors for realizing compact and highly efficient dielectric polymer capacitors. However, high-energy-density polymer dielectrics are limited by insurmountable drawbacks of high energy loss and low charge-discharge efficiency, which are far behind the industrial requirement for application under high temperature/voltage working conditions. Herein, a versatile method to suppress the energy loss of polymer dielectrics is presented, whereby two-dimensional montmorillonite nanosheets are interposed at the interfaces of a sandwich-structured barium titanate/polyamideimide film. The anisotropic electrical conductivity of the nanosheets provides paths to relationally regulate the charges transport along the in-plane direction while suppressing the through-plane conduction. As a result, nearly 50% of the energy loss can be eliminated with an applied electric field of 400 MV m−1 at 150 °C, thus leading to a ~100% enhancement of energy density (3.6 J cm−1), accompanied with a high charge-discharge efficiency of 70%, which outperforms all commercial high-temperature polymers. This work uncovers an effective and scalable pathway to enable high-density dielectric energy storage applicable to a wide range of polymer dielectrics at harsh operating conditions while promoting mechanism understanding of interfaces for interfacial engineering of high-performance dielectrics.

engineering, chemical, environmental
Designing tailored combinations of structural units in polymer dielectrics for high-temperature capacitive energy storage

Rui Wang,Yujie Zhu,Jing Fu,Mingcong Yang,Zhaoyu Ran,Junluo Li,Manxi Li,Jun Hu,Jinliang He,Qi Li

DOI: https://doi.org/10.1038/s41467-023-38145-w

IF: 16.6

2023-04-26

Nature Communications

Abstract:Abstract Many mainstream dielectric energy storage technologies in the emergent applications, such as renewable energy, electrified transportations and advanced propulsion systems, are usually required to operate under harsh-temperature conditions. However, excellent capacitive performance and thermal stability tend to be mutually exclusive in the current polymer dielectric materials and applications. Here, we report a strategy to tailor structural units for the design of high-temperature polymer dielectrics. A library of polyimide-derived polymers from diverse combinations of structural units are predicted, and 12 representative polymers are synthesized for direct experimental investigation. This study provides important insights into decisive structural factors necessary to achieve robust and stable dielectrics with high energy storage capabilities at elevated temperature. We also find that the high-temperature insulation performance would experience diminishing marginal utility as the bandgap increases beyond a critical point, which is strongly correlated to the dihedral angle between neighboring planes of conjugation in these polymers. By experimentally testing the optimized and predicted structures, an increased energy storage at temperatures up to 250 °C is observed. We discuss the possibility for this strategy to be generally applied to other polymer dielectrics to achieve further performance enhancement.

multidisciplinary sciences
Facile synthesis of super-thermal insulating polyimide aerogel-like films

Jing Ma,Yonghui Lü,Hua Wen,Yupei Zhang,Wei Wei,Guotong Qin,Yong Zhao,Lei Jiang,Lihong Liu,Shaomin Liu

DOI: https://doi.org/10.1016/j.isci.2022.105641

IF: 5.8

2022-12-01

iScience

Abstract:Thermal superinsulation materials play a key role in reducing energy consumption. In this article, flexible polyimide aerogel-like films are developed by a facile non-solvent-induced phase separation combined with ambient drying method. The pore structure and insulation properties are well controlled by changing the compositions of the coagulation bath. Polyimide films with macro-nano hierarchical pore structure and uniform nanopores are prepared by adjusting the content of water and alcohol as the non-solvent. The relationship between the insulation performance and textured structure of polyimide was studied. After optimization, the produced film achieved a low thermal conductivity of 0.019 W⋅m-1·K-1 but good tensile strength of 89.6 MPa, compared favorably with literature results. Hence, this article demonstrates that application of the facile phase inversion method to prepare porous polymers can be expanded from desalination or gas separation fields to insulation for energy-saving purposes.

multidisciplinary sciences
Ductile Polymer-Based Films with Ultrahigh Permittivity and Low Dielectric Loss

Ming-Sheng Zheng,Jun-Wei Zha,Yu Yang,Chao-Qun Li,Peng Han,Chao-He Hu,Yong-Qiang Wen,Zhi-Min Dang

DOI: https://doi.org/10.1016/j.polymer.2017.10.026

IF: 4.6

2017-01-01

Polymer

Abstract:High-permittivity (high-k) materials play a key role in advanced electronics and electrical power systems. How to prepare the flexible material with high permittivity and low dielectric loss turns out to be a hard work due to the essential low permittivity of polymers. In this work, a kind of ductile polymer-based composites was fabricated by incorporating ionic liquids into polymer matrices. The optimized permittivity of composite with 50 wt% ionic liquid reached up to 3.3 x 10(4), while the dielectric loss was as low as 0.65. The temperature dependence of dielectric properties was also investigated, and a high permittivity as well as low dielectric loss at 100 Hz of about 2.0 x 10(4) and 0.23 were achieved at 80 degrees C, respectively. Furthermore, the study reveals that the dielectric loss peaks of the composite films can be affected by the content of ionic liquid, temperature even the size of ions. In short, the finding indicates that the addition of ionic liquids into polymers provides a big opportunity to improve dielectric properties of polymer materials. (C) 2017 Elsevier Ltd. All rights reserved.
Polyamideimide dielectric with montmorillonite nanosheets coating for high-temperature energy storage

Yifei Wang,Zongze Li,Chao Wu,Peinan Zhou,Jierui Zhou,Jindong Huo,Kerry Davis,Antigoni C. Konstantinou,Hiep Nguyen,Yang Cao

DOI: https://doi.org/10.1016/j.cej.2022.135430

IF: 15.1

2022-06-01

Chemical Engineering Journal

Abstract:To meet the ever-increasing demand for electric power storage and conversion under harsh environment, polymer dielectrics, as the functional component in electrostatic capacitors, are required to serve at high temperatures. However, it is challenging to maintain favorable electrical insulation in polymer dielectrics with the temperature rise because of the high conduction loss at elevated temperature, which will lead to reduced breakdown strength, energy density, and service life. Here, a versatile surface engineering method is presented to enhance the high-temperature electrical insulation and energy storage performance of polymer dielectric via dip-coating montmorillonite (MMT) nanosheets. At 150 °C, a significantly enhanced breakdown strength of 551MV/m is achieved in a MMT coated polyamideimide (PAI) with optimized coating thickness and MMT content, resulting in a high energy density of 2.9 J cm−3 and a charge-discharge efficiency >80% that outperform existing high-temperature polymers and polyimide-based composites. Finite element simulation demonstrates that this superior performance is attributed to the anisotropic electrical properties of MMT nanosheets, which not only blocks charges injected from electrodes but also regulates the transport of charges to dissipate along the in-plane direction. This work offers a versatile and scalable approach for enabling high-temperature electrostatic energy storage and high-temperature insulation of a wide range of polymer dielectrics.

engineering, chemical, environmental
A Ternary Co-polyimide for High-temperature Capacitive Energy Storage

Manxi Li,Yujie Zhu,Jinliang He,Qi Li

DOI: https://doi.org/10.1109/icd59037.2024.10613056

2024-01-01

Abstract:The development of modern power electronic systems places increasing demands on polymer dielectrics for continuous operation under extreme conditions of high temperature and high electric field. However, the insulating and thermal stability of current polymer dielectrics are often contradictory and mutually exclusive. Herein, we report a ternary co-polyimide that introduces both a highly rigid main-chains and saturated alicyclic side-chains. The former ensures the stability of the copolymer at elevated temperatures and reduces intrachain charge transfer due to its isopropyl structural units with large dihedral angles. The latter increases the molecular chain spacing and decreases interchain charge transfer due to its bulky alicyclic side groups. The resultant copolymer shows decent discharge energy density with 90% charge-discharge efficiency at 200 °C (6.1 J/cm 3 ) and 250 °C (3.1 J/cm 3 ), far exceeding those of conventional dielectric polymers and polymer composites. Here a completely new dimension is offered for the molecular design of polymers, giving rise to well-balanced thermal and dielectric properties, and ultimately the desired capacitive energy storage performance at high temperatures. The molecular design strategy in this work regulates the charge transfer process based on the intrinsic structure of the polymer and provides a new perspective for the future development of advanced high-temperature polymer dielectrics.
Tailoring Poly(styrene‐co‐maleic anhydride) Networks for All‐Polymer Dielectrics Exhibiting Ultrahigh Energy Density and Charge‐Discharge Efficiency at Elevated Temperatures

Zizhao Pan,Li Li,Lina Wang,Guangfu Luo,Xinwei Xu,Fei Jin,Jiufeng Dong,Yujuan Niu,Liang Sun,Chuanfei Guo,Wenqing Zhang,Qing Wang,Hong Wang

DOI: https://doi.org/10.1002/adma.202207580

IF: 29.4

2022-11-05

Advanced Materials

Abstract:Polymer film capacitors have been widely used in electronics and electrical power systems due to their advantages of high power densities, fast charge‐discharge speed and great stability. However, the exponential increase of electrical conduction with temperature and applied electric field substantially degrades the capacitive performance of dielectric polymers at elevated temperatures. Here, we report the first example of controlling the energy level of charge traps in all‐organic crosslinked polymers by tailoring molecular structures that significantly inhibit high‐field high‐temperature conduction loss, which largely differs from current approaches based on introducion of inorganic fillers. The polymer network with optimized crosslinking strutures exhibits an ultrahigh discharged energy density of 7.02 J cm−3 with charge/discharge efficiencies > 90% at 150°C, far outperforming current dielectric polymers and composites. The charge trapping effects in different crosslinked structures, as the origins of the marked improvements in the high‐temperature capacitive performance, have been comprehensively investigated experimentally and confirmed computationally. Moreover, excellent cyclability and self‐healing feature have been demonstrated in the polymer film capacitors. This work offers a promising pathway of molecular structure design to scalable high‐energy‐density polymer dielectrics capable of operating under harsh environments. This article is protected by copyright. All rights reserved

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology

Solution-shearing of dielectric polymer with high thermal conductivity and electric insulation

Significantly enhancing the discharge efficiency of sandwich-structured polymer dielectrics at elevated temperature by building carrier blocking interface

Dielectric polymer composites with ultra-high thermal conductivity and low dielectric loss

Scalable self-assembly interfacial engineering for high-temperature dielectric energy storage

Improving the Rotational Freedom of Polyetherimide: Enhancement of the Dielectric Properties of a Commodity High-Temperature Polymer Using a Structural Defect

Enhanced thermal conductivity in copolymerized polyimide

High-temperature dielectric with excellent capacitive performance enabled by rationally designed traps in blends

Highly efficient thermal conductivity of polyarylene ether nitrile composites via the introduction of hybrid fillers and tailored cross-linked structure

Inhibition conduction loss for distinct improvement of energy storage density over a broad temperature range in polyetherimide-based composite films

High Thermal Conductivity Polyelectrolyte Nanocomposite Electrical Insulation Thin Films

Thermally activated dynamic bonding network for enhancing high-temperature energy storage performance of PEI-based dielectrics

Evaluation of the Dielectric and Insulating Properties of Newly Synthesized Ethylene/1-Hexene/4-Vinylcyclohexene Terpolymers

Fully Organic Bulk Polymer with Metallic Thermal Conductivity and Tunable Thermal Pathways

Scalable Polyimide‐Organosilicate Hybrid Films for High‐Temperature Capacitive Energy Storage

High-temperature dielectric polymer nanocomposites with interposed montmorillonite nanosheets

Designing tailored combinations of structural units in polymer dielectrics for high-temperature capacitive energy storage

Facile synthesis of super-thermal insulating polyimide aerogel-like films

Ductile Polymer-Based Films with Ultrahigh Permittivity and Low Dielectric Loss

Polyamideimide dielectric with montmorillonite nanosheets coating for high-temperature energy storage

A Ternary Co-polyimide for High-temperature Capacitive Energy Storage

Tailoring Poly(styrene‐co‐maleic anhydride) Networks for All‐Polymer Dielectrics Exhibiting Ultrahigh Energy Density and Charge‐Discharge Efficiency at Elevated Temperatures