Inside view of substrate engineering and its future

R. Todi,S. Sood

DOI: https://doi.org/10.1109/MP.2007.343039

2007-04-10

IEEE Potentials

Abstract:SOI is a substrate engineered by placing a thin insulating layer, such as silicon oxide or glass, between a thin layer of silicon and the silicon substrate. By offering an opportunity to deliver higher speed and also lowering power consumption, SOI has extended the track for the industry to keep chasing Moore's law. In this article, we attempt to present the current status and future perspectives of SOI technology