Extrusion‐based 3D‐Printed Supercapacitors: Recent Progress and Challenges

Xiao Yan,Yueyu Tong,Xinzhong Wang,Feng Hou,Ji Liang
DOI: https://doi.org/10.1002/eem2.12260
2021-08-11
Abstract:Supercapacitors (SCs) have been regarded as promising power supplies for future electronics due to their high power density, superior stability, easy integration, and safety. Extrusion-based three-dimensional (3D) printing technologies hold promise to satisfy the demands for integrated and flexible SCs because of their highly versatile manufacturing process. In this review article, a comprehensive and timely review of these state-of-the-art technologies is presented. We start with a brief introduction of fundamental concepts of SCs, including energy storage mechanisms and device structures. Then, the latest progress of extrusion-based 3D printing technologies (e.g., fused deposition modeling, inkjet printing, and direct ink writing) along with their applications for manufacturing SCs are summarized. The choice of printable materials (e.g., graphene, carbon nanotubes, metal oxides, and MXenes), printing process, and the resulted electrochemical performances of SCs are especially emphasized. Finally, the development of extrusion-based 3D printing SCs is summarized, with existing challenges diagnosed, possible solutions proposed, and future outlooks forecasted. We hope this review can offer insights to further improve the performance of 3D printed SCs for practical applications.
materials science, multidisciplinary
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