Abstract:Soy-based adhesives are environmentally friendly alternatives to the harmful formaldehyde-based resins in manufacturing wood-based panels. However, almost all of the modification methods use large amounts of additives that negatively impact the environment. Therefore, using a low-dosage cross-linker to improve both adhesive bond performance and toughness remains a challenge in soy-based adhesive modification, thereby limiting its applicability. Inspired by the microphase-separated structure giving spider silk high toughness and performance, TEMPO-oxidized cellulose nanofibers (TOCNFs, hard phase) were grafted by the hydroxymethyl melamine prepolymer (HMP, enhance the TOCNFs/SF interface) to form HTs, and then mixed with soy flour (SF, soft phase) to develop a novel soy protein-based adhesive. This microphase structure effectively improved the toughness of the soy-based adhesive, while the HTs reacted with SF to form a cross-linked structure, which enhanced the water resistance of the soy-based adhesive and hindered the formation and expansion of cracks during the breaking process. The results show that by using only 0.7% HTs in the adhesive formulation, the dry and wet shear strengths of the resultant plywood increase by 117 and 322%, respectively, while wood failure reaches 90%, which satisfies the requirements for interior plywood use. Thus, using a low-dosage (72–94% lower compared to those in the literature) nanomaterial to build a microphase-separated structure in a soy-based adhesive is a promising means for plywood production.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acssuschemeng.0c06333?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acssuschemeng.0c06333</a>.Viscosity of different adhesives; photos of different adhesives; formaldehyde emission of plywood panels bonded by different adhesives; dry strength, wet strength, MOR, MOE, residual rate, and wood failure of commercial MUF resin and SF/HTs adhesive (<a class="ext-link" href="/doi/suppl/10.1021/acssuschemeng.0c06333/suppl_file/sc0c06333_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

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