Fine Pitch High Pin Count AIN LGga Package

H. Asai,J. Kudo,K. Yano,T. Yasumoto,K. Kimura,K. Iyogi,J. Moruna,H. Yamaguchi,N. Iwasc
1997-04-16
Abstract:This work studied ways to rcducc a flip chip asscinbling cost. I t was hypothcsizcd that low cost asscinbling would be achieved by lowering the bump height on a chip and by eliminating an underfilling work which is incorporated to assure soldcr joint reliability. Among several candidates for package materials such as plastic, metals, and ceramics, aluininuin nitride (AIN) was examined to rcducc a flip chip asscinbling cost. I n this report, an AIN LGA (land grid array) package was manufactured and cvaluatcd on its flatncss of a chip attaching area and on clcctrical characteristics. Flatness was found to be low (5.5 / L in). The package showcd possibility to usc a chip with low bumps. AIN also showcd high soldcr joint rcliability with a low bump of 27 / r in. This is bccausc coefficient of thermal expansion (CTE) of AIN is closc to that of silicon (Si). I t was found thal an AIN package was a possible candidate for establishing a lower bump flip chip assembly coinparcd with a packagc rnadc of plastic or alumina. The plating tcchnology uscd in this AIN package was proved to be applicable for a tine pitch flip chip assembly.
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