Continuous Surface Metallization of Polyimide Fibers for Textile-Substrate Electromagnetic Shielding Applications

Shixu Zhou,Jie Dong,Xiuting Li,Xin Zhao,Qinghua Zhang

DOI: https://doi.org/10.1007/s42765-023-00317-0

IF: 12.958

2023-07-28

Advanced Fiber Materials

Abstract:Despite tremendous effort, continuous fabrication of high-performance conductive polymer fibers for electromagnetic interference (EMI) shielding applications remains a daunting technical challenge. In the current study, we report an efficient strategy for continuous surface metallization of polyimide fibers used in textile-substrate electromagnetic shielding applications. Polyimide fibers with pendent carboxyl groups (PIC) were first fabricated, and a conductive nickel layer was continuously coated on the PIC surface by electroless metal deposition (ELD). The carboxyl groups introduced onto the fiber surface acted as binding sites for the Ni2+ ions, and the complexation reactions greatly increased the Ni2+ adsorption capacity and efficiency of the PIC fibers during the ELD process and ensured continuous fabrication. Through judicious control of the plating time, a series of nickel-layer-coated PIC fibers (Ni-PIC) were constructed with Ni loadings ranging from 20 to 230 wt%. The resultant Ni-PIC fiber containing 65 wt% Ni exhibited conductivity of 223 S cm− 1, and the corresponding fabric exhibited an EMI shielding effectiveness (EMI SE) of 44 dB in the X-band. The corresponding EMI SE was further improved to 83 dB after the fiber was treated at 300 °C for 1 h because of the crystallization of the Ni layer. The prepared Ni-PIC fibers and fabrics were also used in pressure sensors and electrothermal conversion, which demonstrated outstanding adaptabilities to various temperatures and mechanical properties. Overall, this work provides an efficient route for developing high-performance conductive polyimide fibers for EMI shielding applications, especially for use in military and aerospace equipment and in other harsh environments.Graphical AbstractAn electroless metal deposition (ELD) process was used for continuous surface metallization of polyimide fibers for textile-substrate electromagnetic shielding applications. The pendent carboxyl groups in the polyimide chains increased the capacity and efficiency for Ni2+ adsorption by PIC fibers during the ELD process and ensured continuous fabrication of the Ni-coated polyimide fibers. Accordingly, the resulting textiles containing the Ni-coated polyimide fibers exhibited an excellent EMI shielding property.

materials science, multidisciplinary, textiles