Design and Analysis of an H-Type Pickup for Multi-Segment Wireless Power Transfer Systems

Jintao Wang,Yanjin Hou,Zhuoqun Shi,Qianfang Sun,Yanhua Guo,Shengkun Cai,Zhizhen Liu

DOI: https://doi.org/10.3390/electronics13061125

IF: 2.9

2024-03-20

Electronics

Abstract:To tackle the complex wireless power supply requirements in the Automated Material Handling System (AMHS) of semiconductor wafer factories, this paper presents a design method for a magnetic coupling mechanism based on a Multi-Segment Wireless Power Transfer (MSWPT) system for dynamic wireless power supply in segmented track configurations. Firstly, the track is approached using Inductive Power Transfer (IPT) technology combined with an LCC-S resonant structure transmitter (Tx). Following this, the feasibility of the H-type pickup is assessed through magnetic and electrical circuit analyses, which leads to the preliminary determination of the pickup dimensions by means of finite element magnetic and thermal simulations. Furthermore, an analysis of the mutual inductance drop is conducted under various track structure parameters during track crossing and curve negotiation operation conditions. Secondly, a dual-coil winding method is proposed to reduce the insulation stress on the PCB board. Additionally, a method for calculating the wire length and a design process for the overall parameters of the pickup are derived. Finally, two Txs and a 1.5 kW power receiver (Rx) were designed to verify the mutual inductance fall under the aforementioned conditions. During low-speed full-load operations, a constant-voltage output was achieved through the proposed dual-loop PI control strategy, thereby meeting the requirements for a constant-voltage output in industrial applications.

engineering, electrical & electronic,computer science, information systems,physics, applied

What problem does this paper attempt to address?

The paper attempts to address the issue of achieving complex wireless power supply requirements in the Automated Material Handling System (AMHS) of semiconductor wafer fabs. Specifically, the paper proposes a magnetic coupling mechanism design method based on a Multi-Section Wireless Power Transfer (MSWPT) system for dynamic wireless power supply in segmented track configurations. The main issues addressed in the paper are as follows:

1. **Complex Wireless Power Supply Requirements**: In the AMHS of semiconductor wafer fabs, efficient energy transfer needs to be achieved in a dust-free, high-precision environment. Traditional wired power supply methods have issues with mechanical wear and dust, thus a contactless wireless power supply solution is needed.

2. **Magnetic Coupling Mechanism Design**: The paper proposes a design method for an H-type pickup using Inductive Power Transfer (IPT) technology and an LCC-S resonant structure transmitter (Tx) to achieve wireless power supply for multi-section tracks. The design method includes magnetic circuit and electrical circuit analysis, as well as finite element magnetic-thermal simulation to preliminarily determine the size of the pickup.

3. **Mutual Inductance Drop Analysis**: The paper analyzes the mutual inductance drop under different track structure parameters, track switching, and curve running operation conditions to ensure the stability and efficiency of the system.

4. **Double Coil Winding Method**: To reduce insulation stress on the PCB board, the paper proposes a double coil winding method and derives methods for calculating wire length and overall parameter design.

5. **Experimental Verification**: The paper designs two transmitters (Tx) and a 1.5 kW receiver (Rx), and experimentally verifies that under low-speed full-load operating conditions, the proposed dual-loop PI control strategy achieves constant voltage output, meeting industrial application requirements.

In summary, the paper aims to address the complex wireless power supply requirements in the AMHS of semiconductor wafer fabs by designing and analyzing the H-type pickup and related technologies, thereby improving the stability and efficiency of the system.