Reliability assurance for devices with a sudden-failure characteristic

R. H. Saul,F. Chen
DOI: https://doi.org/10.1109/EDL.1983.25805
IF: 4.8157
1983-12-01
IEEE Electron Device Letters
Abstract:Reliability assurance is particularly challenging for devices which have a sudden-failure characteristic. The use of a purging procedure which utilizes high thermal and nonthermal stresses is shown to have considerable promise in identifying for removal devices which otherwise fail early in the system life cycle.
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