Thruchip interface (TCI) for 3D integration of low-power system

T. Kuroda
DOI: https://doi.org/10.1109/IEDM.2010.5703378
2010-12-01
Abstract:This paper presents a counterpart of TSV and a circuit solution that enables 3D integration of power-aware systems. It bears comparison with TSV in performance but less expensive.
What problem does this paper attempt to address?