Unlocking Larger Scales and Aspect Ratios in 3D Printed Glass: Coupling Active Mixing and UV Curing for Advanced Printability and Crack Resistance

Beck L. Walton,Nikola A. Dudukovic,Jason Johnson,Timothy D. Yee,Du T. Nguyen,Megan E. Ellis,Dominique H. Porcincula,Caitlyn C. Krikorian,Eric B. Duoss,Rebecca J. Dylla‐Spears
DOI: https://doi.org/10.1002/admt.202401284
IF: 6.8
2024-11-28
Advanced Materials Technologies
Abstract:This article highlights the development of a UV‐active direct ink writing (DIW) formulation and processing route to achieve a 3× increase in the size of crack‐free silica glass processable with DIW. The capability to print 44 mm diameter space‐filling and thin‐walled structures, which are polishable and multicomposition, facilitates fabrication of novel lightweight optics and unique compositional gradients. Recent developments in additive manufacturing (AM) of glass via silica‐filled inks have facilitated fabrication of previously unattainable geometries and compositions. However, the maximum processable size of 15 mm limits the use of these prints in applications such as optics. A key limitation lies in the trade‐off between material printability and green strength: increasing silica content in the feedstock improves crack resistance and reduces shrinkage but results in dramatic changes in viscoelastic properties that hinder flowability. This paper presents a novel approach that offers expanded versatility in processable size, feedstock formulation, and printing. Described here is a direct ink writing (DIW) system coupled with an active high‐shear micromixer and UV light source, capable of simultaneously printing multiple inks with a wide range of rheological properties. Choice of silica sourc, solvent, UV‐curable binder, and dispersant is used to tune the ink rheology and improve printability and mechanical properties. Imparting high shear with the micromixer while UV‐curing the extrudate allows for increased ink viscosities and reduced nozzle diameters, enabling printing finer feature sizes. With these advances, thin‐walled high‐aspect ratio structures and a crack‐free glass disk measuring 44 mm in diameter are demonstrated, an increase of 3× in the greatest dimension compared to current state‐of‐the‐art.
materials science, multidisciplinary
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