Product reliability discussion group

A. Turner,Y. Kuo

DOI: https://doi.org/10.1109/IRWS.2004.1422775

2004-10-18

Abstract:As chip integration increases and SOC architectures gain wider implementation, the reliability per device will need to increase accordingly. Furthermore, as our world becomes further dependent on microelectronic products, the expectation of reliability will increase. An example is the drive-by-wire active braking systems in automobiles. The most powerful method in reducing the module level defect population has been bum-in, but due to rising costs and increasing power densities novel approaches must be used to extend the feasibility of manufacturing burn-in. The discussion will include (but not be limited to) product reliability, early fails and defects, Burn-In and it's reduction, useful lifetime targets and conditions (e.g. the operation temperature of a cellular phone is never over 40°C, because then you cannot touch it anymore).