Abstract:Poor DRAM technology scaling over the course of many years has caused DRAM-based main memory to increasingly become a larger system bottleneck. A major reason for the bottleneck is that data stored within DRAM must be moved across a pin-limited memory channel to the CPU before any computation can take place. This requires a high latency and energy overhead, and the data often cannot benefit from caching in the CPU, making it difficult to amortize the overhead. Modern 3D-stacked DRAM architectures include a logic layer, where compute logic can be integrated underneath multiple layers of DRAM cell arrays within the same chip. Architects can take advantage of the logic layer to perform processing-in-memory (PIM), or near-data processing. In a PIM architecture, the logic layer within DRAM has access to the high internal bandwidth available within 3D-stacked DRAM (which is much greater than the bandwidth available between DRAM and the CPU). Thus, PIM architectures can effectively free up valuable memory channel bandwidth while reducing system energy consumption. A number of important issues arise when we add compute logic to DRAM. In particular, the logic does not have low-latency access to common CPU structures that are essential for modern application execution, such as the virtual memory and cache coherence mechanisms. To ease the widespread adoption of PIM, we ideally would like to maintain traditional virtual memory abstractions and the shared memory programming model. This requires efficient mechanisms that can provide logic in DRAM with access to CPU structures without having to communicate frequently with the CPU. To this end, we propose and evaluate two general-purpose solutions that minimize unnecessary off-chip communication for PIM architectures. We show that both mechanisms improve the performance and energy consumption of many important memory-intensive applications.

Low-Power Encoding for PAM-3 DRAM Bus

A Low-Power In-Memory Multiplication and Accumulation Array with Modified Radix-4 Input and Canonical Signed Digit Weights

PIM-MMU: A Memory Management Unit for Accelerating Data Transfers in Commercial PIM Systems

Hardware Architecture and Software Stack for PIM Based on Commercial DRAM Technology : Industrial Product

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Low-Power Off-Chip Memory Design for Video Decoder Using Embedded Bus-Invert Coding

NicePIM: Design Space Exploration for Processing-In-Memory DNN Accelerators with 3D-Stacked-DRAM

TIMELY: Pushing Data Movements and Interfaces in PIM Accelerators Towards Local and in Time Domain

A Hybrid Main Memory Architecture Design for Reducing DRAM System Refresh Power

Design Of Almost-Nonvolatile Embedded Dram Using Nanoelectromechanical Relay Devices

An eDRAM with Logic Technology Using High-Speed R/W and Compact Charge Transfer Refresh Scheme

A$^3$PIM: An Automated, Analytic and Accurate Processing-in-Memory Offloader

Optimized Signal Transmission Schemes for High Density Edram

MIMDRAM: An End-to-End Processing-Using-DRAM System for High-Throughput, Energy-Efficient and Programmer-Transparent Multiple-Instruction Multiple-Data Processing

PM3: Power Modeling and Power Management for Processing-in-Memory

CODIC: A Low-Cost Substrate for Enabling Custom In-DRAM Functionalities and Optimizations

Energy-efficient Multi-Level Cell Phase-Change Memory System with Data Encoding.

Design of a Fast and Low-Power Sense Amplifier and Writing Circuit for High-Speed MRAM

Characterization and Mitigation of Electromigration Effects in TSV-Based Power Delivery Network Enabled 3D-Stacked DRAMs

Utilizing PCM for Energy Optimization in Embedded Systems

Cryogenic quasi-static embedded DRAM for energy-efficient compute-in-memory applications