Hyperspectral Dataset and Deep Learning methods for Waste from Electric and Electronic Equipment Identification (WEEE)

Artzai Picon,Pablo Galan,Arantza Bereciartua-Perez,Leire Benito-del-Valle
2024-07-05
Abstract:Hyperspectral imaging, a rapidly evolving field, has witnessed the ascendancy of deep learning techniques, supplanting classical feature extraction and classification methods in various applications. However, many researchers employ arbitrary architectures for hyperspectral image processing, often without rigorous analysis of the interplay between spectral and spatial information. This oversight neglects the implications of combining these two modalities on model performance. In this paper, we evaluate the performance of diverse deep learning architectures for hyperspectral image segmentation. Our analysis disentangles the impact of different architectures, spanning various spectral and spatial granularities. Specifically, we investigate the effects of spectral resolution (capturing spectral information) and spatial texture (conveying spatial details) on segmentation outcomes. Additionally, we explore the transferability of knowledge from large pre-trained image foundation models, originally designed for RGB images, to the hyperspectral domain. Results show that incorporating spatial information alongside spectral data leads to improved segmentation results, and that it is essential to further work on novel architectures comprising spectral and spatial information and on the adaption of RGB foundation models into the hyperspectral domain. Furthermore, we contribute to the field by cleaning and publicly releasing the Tecnalia WEEE Hyperspectral dataset. This dataset contains different non-ferrous fractions of Waste Electrical and Electronic Equipment (WEEE), including Copper, Brass, Aluminum, Stainless Steel, and White Copper, spanning the range of 400 to 1000 nm. We expect these conclusions can guide novel researchers in the field of hyperspectral imaging.
Computer Vision and Pattern Recognition,Image and Video Processing
What problem does this paper attempt to address?
The paper mainly addresses the following issues: 1. **Evaluating the performance of different deep learning architectures in hyperspectral image segmentation tasks**: The study compares various deep learning architectures (including 1D encoder-decoder using only spectral information, 2D encoder-decoder integrating spatial information, and U-Net style architectures) in handling hyperspectral images. The aim is to analyze the ability of different architectures to process spectral and spatial information and their impact on the final segmentation results. 2. **Exploring the impact of spectral resolution and spatial texture on segmentation results**: Through experiments, the paper verifies the influence of different numbers of spectral bands (from RGB to all 76 bands) and different spatial resolutions on the quality of hyperspectral image segmentation. It is found that combining spectral and spatial information can significantly improve segmentation performance. 3. **Exploring the adaptability of pre-trained base models in the hyperspectral domain**: The paper attempts to apply large-scale pre-trained models originally used for RGB images (such as DINOv2) to hyperspectral images and analyzes whether these models can effectively transfer knowledge from RGB images to hyperspectral images to improve segmentation results. 4. **Releasing and making public a new hyperspectral dataset**: The paper contributes a hyperspectral dataset containing various non-ferrous metal waste (Tecnalia WEEE Hyperspectral dataset), aiming to provide researchers in the hyperspectral imaging field with a standardized dataset for model training and performance evaluation. In summary, this paper focuses on experimentally evaluating the ability of different deep learning architectures to handle hyperspectral images, exploring how to better utilize spectral and spatial information to improve segmentation results, and providing valuable data resources for further research in this field.