Chiplet Placement Order Exploration Based on Learning to Rank with Graph Representation

Zhihui Deng,Yuanyuan Duan,Leilai Shao,Xiaolei Zhu
2024-04-07
Abstract:Chiplet-based systems, integrating various silicon dies manufactured at different integrated circuit technology nodes on a carrier interposer, have garnered significant attention in recent years due to their cost-effectiveness and competitive performance. The widespread adoption of reinforcement learning as a sequential placement method has introduced a new challenge in determining the optimal placement order for each chiplet. The order in which chiplets are placed on the interposer influences the spatial resources available for earlier and later placed chiplets, making the placement results highly sensitive to the sequence of chiplet placement. To address these challenges, we propose a learning to rank approach with graph representation, building upon the reinforcement learning framework RLPlanner. This method aims to select the optimal chiplet placement order for each chiplet-based system. Experimental results demonstrate that compared to placement order obtained solely based on the descending order of the chiplet area and the number of interconnect wires between the chiplets, utilizing the placement order obtained from the learning to rank network leads to further improvements in system temperature and inter-chiplet wirelength. Specifically, applying the top-ranked placement order obtained from the learning to rank network results in a 10.05% reduction in total inter-chiplet wirelength and a 1.01% improvement in peak system temperature during the chiplet placement process.
Machine Learning,Artificial Intelligence,Hardware Architecture
What problem does this paper attempt to address?
### Problems Addressed by the Paper The paper aims to address the issue of optimizing the chiplet placement order in chiplet-based systems. Specifically, it focuses on determining the optimal chiplet placement order to achieve system performance optimization. Chiplet systems, which integrate various silicon dies manufactured using different process nodes onto a single interposer, have gained widespread attention in recent years due to their cost-effectiveness and competitiveness. However, with the widespread application of reinforcement learning methods in sequential placement, determining the optimal placement order for each chiplet has become a new challenge. The paper proposes a Learning to Rank (LTR) method based on graph representation, which builds upon the existing reinforcement learning framework RLPlanner. The goal of this method is to select the optimal placement order from all possible placement sequences to minimize wirelength and improve system temperature. Experimental results show that the placement order obtained using the LTR network can further enhance system temperature and interconnect wirelength performance compared to methods that arrange chiplets in descending order based solely on chiplet area and the number of interconnect lines. Specifically, the total wirelength is reduced by 10.05%, and the peak system temperature is lowered by 1.01%. In summary, the paper presents an effective method for determining chiplet placement order to optimize system performance, providing strong support for early chiplet design.