Abstract:Heat transfer is studied in the system of electron double layers of correlated composite fermion quantum liquids. In the near-field regime, the primary mechanism governing interlayer energy transfer is mediated by the Coulomb interaction of thermally-driven charge density fluctuations. The corresponding interlayer thermal conductance is computed across various limiting cases of the composite fermion Chern-Simons gauge theory, encompassing ballistic, diffusive, and hydrodynamic regimes. Plasmon enhancement of the heat transfer is discussed. The relationship between the heat transfer conductance and the drag resistance is presented for electron states formed in the fractional quantum Hall effect of even denominator filling fractions.
What problem does this paper attempt to address?
The problem that this paper attempts to solve is the heat transfer and drag resistance under the near - field effect in the double - layer composite fermion system. Specifically, the research objectives include:
1. **Near - field heat transfer**: Explore that in the near - field region of the double - layer electron system, the main mechanism of inter - layer energy transfer is mediated by the Coulomb interaction between thermally - driven charge density fluctuations. The paper calculates the inter - layer thermal conductivity in different limit cases, covering different mechanisms such as ballistic, diffusive and hydrodynamic.
2. **Drag resistance**: Analyze the relationship between the heat transfer conductivity and the drag resistance at the even - denominator filling fraction in the fractional quantum Hall effect of the electron state formed by composite fermions.
### Specific problem description
#### Heat transfer mechanism
- In the near - field effect, when the distance between the two layers is less than the thermal de Broglie wavelength of photons, the heat flux is mainly dominated by the fluctuation - driven near - field attenuated electromagnetic mode.
- For the conductive layer, this near - field effect is mainly dominated by the Coulomb interaction between the inter - layer electron density thermal fluctuations.
#### Drag resistance
- Drag resistance refers to the phenomenon that in a double - layer system, the driving current in one layer will induce a drag voltage in the other layer. This is mainly due to the non - local transport effect caused by the Coulomb interaction between the layers.
### Research background and motivation
The motivation of the paper stems from the physical properties of double - layer systems, especially the near - field effect in the composite fermion double - layer system has not been fully explored. By studying these effects, the author hopes to reveal the unique heat transfer and drag resistance characteristics in the composite fermion system and provide theoretical support for related experiments.
### Research methods
1. **Near - field heat transfer**:
- Calculate the near - field thermal conductivity using the random - phase approximation (RPA).
- Consider impurity scattering through the Boltzmann equation and derive heat transfer in the diffusive limit.
- Explore the composite fermion liquid in the hydrodynamic limit, assume rapid intra - layer equilibrium and introduce a disorder potential with a long correlation radius.
2. **Drag resistance**:
- Review the known drag resistance results of double - layer electron systems at half - filling of Landau levels.
- Analyze several experimentally relevant limit cases, especially the behavior at low and high temperatures.
### Conclusions and prospects
Through a detailed study of near - field heat transfer and drag resistance in the composite fermion double - layer system, the paper reveals the unique physical phenomena in these systems and provides an important reference for further experimental and theoretical research. In particular, the study finds that the weak screening effect causes the attenuation of the heat transfer conductivity with the layer spacing to slow down significantly, thus providing a stronger effect than the traditional Fermi liquid.