Fluxonium Qubits in a Flip-Chip Package

Aaron Somoroff,Patrick Truitt,Adam Weis,Jacob Bernhardt,Daniel Yohannes,Jason Walter,Konstantin Kalashnikov,Mario Renzullo,Raymond A. Mencia,Maxim G. Vavilov,Vladimir E. Manucharyan,Igor V. Vernik,Oleg Mukhanov
2023-12-12
Abstract:The strong anharmonicity and high coherence times inherent to fluxonium superconducting circuits are beneficial for quantum information processing. In addition to requiring high-quality physical qubits, a quantum processor needs to be assembled in a manner that minimizes crosstalk and decoherence. In this paper, we report work on fluxonium qubits packaged in a flip-chip architecture, where a classical control and readout chip is bump-bonded to the quantum chip, forming a multi-chip module (MCM). The modular approach allows for improved connectivity between the qubits and control/readout elements, and separate fabrication processes. We characterize the coherence properties of the individual fluxonium qubits, demonstrate high fidelity single-qubit gates with 6 ns microwave pulses (without DRAG), and identify the main decoherence mechanisms to improve on the reported results.
Quantum Physics
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