Abstract:Reducing electromagnetic interference (EMI) across a broad radio frequency band is crucial to eliminate adverse effects of increasingly complex electromagnetic environment. Current shielding materials or methods suffer from trade-offs between optical transmittance and EMI shielding capability. Moreover, poor mechanical flexibility and fabrication complexity significantly limit their further applications in flexible electronics. In this work, an ultrathin (8 nm) and continuous doped silver (Ag) film was obtained by introducing a small amout of copper during the sputtering deposition of Ag and investigated as transparent EMI shielding components. The electromagnetic Ag shielding (EMAGS) film was realized in the form of conductive dielectric-metal-dielectric design to relieve the electrooptical trade-offs, which transmits 96.5% visible light relative to the substrate and shows an excellent average EMI shielding effectiveness (SE) of ~26 dB, over a broad bandwidth of 32 GHz, covering the entire X, Ku, Ka and K bands. EMI SE >30 dB was obtained by simply stacking two layers of EMAGS films together, and can be further improved up to 50 dB by separating two layers with a quarter-wavelength space. The flexible EMAGS film demonstrates a stable EMI shielding performance under mechanical deformation. In addition, large-area EMAGS films were demonstrated by a roll-to-roll sputtering system, proving the feasibility for mass-production. The outstanding optical, broadband EMI shielding, and mechanical properties of EMAGS film render it promising for various applications in healthcare, electronic safety, roll-up displays, and wearable devices.

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