iMCU: A 28-nm Digital In-Memory Computing-Based Microcontroller Unit for TinyML
Chuan-Tung Lin,Paul Xuanyuanliang Huang,Jonghyun Oh,Dewei Wang,Mingoo Seok
DOI: https://doi.org/10.1109/jssc.2024.3362274
IF: 5.4
2024-01-01
IEEE Journal of Solid-State Circuits
Abstract:Tiny machine learning (TinyML) envisions executing a deep neural network (DNN)-based inference on an edge device for improving battery life, latency, security, and privacy. Toward this vision, recent microcontroller units (MCUs) integrate in-memory computing (IMC) hardware to leverage its high energy efficiency and throughput in vector–matrix multiplication (VMM). However, those existing works require large IMC hardware, severely increasing the area overhead. In addition, most existing works use analog–mixed-signal (AMS) IMC hardware, exhibiting limited robustness over process, voltage, and temperature (PVT) variations. Finally, none can support a practical software development framework such as TensorFlow Lite for Microcontrollers (TFLite-micro). Due to these limitations, those MCUs did not present the performance for the standard benchmark MLPerf-Tiny, which makes it difficult to evaluate them against the state-of-the-art neural (not necessarily IMC-based) MCUs. In this article, we design a new IMC-based MCU, titled iMCU, for TinyML to address those challenges. In the design process, we: 1) define the optimal set of acceleration targets and 2) devise an area-efficient computation flow that requires the least amount of IMC hardware yet still provides a significant acceleration. In addition, we develop: 1) state-of-the-art digital IMC macros and 2) create the accelerator based on the macros, which can support the proposed computation flow in a fully pipelined manner. Combining those innovations, we prototyped the iMCU in a 28-nm CMOS. The measurement results show that the iMCU significantly outperforms the prior IMC-based MCUs in compute density, energy efficiency, and SRAM density (total SRAM size/total SRAM area). It also achieves a compact footprint of 2.73 mm $^2$ .
engineering, electrical & electronic