Abstract:Microelectronics and electronic products are integral to our increasingly connected world, facing constant challenges in terms of quality, security, and provenance. As technology advances and becomes more complex, the demand for automated solutions to verify the quality and origin of components assembled on printed circuit boards (PCBs) is skyrocketing. This paper proposes an innovative approach to detecting and classifying microelectronic components with impressive accuracy and reliability, paving the way for a more efficient and safer electronics industry. Our approach introduces significant advancements by integrating optical and X-ray imaging, overcoming the limitations of traditional methods that rely on a single imaging modality. This method uses a novel data fusion technique that enhances feature visibility and detectability across various component types, crucial for densely packed PCBs. By leveraging the WaferCaps capsule network, our system improves spatial hierarchy and dynamic routing capabilities, leading to robust and accurate classifications. We employ decision-level fusion across multiple classifiers trained on different representations—optical, X-ray, and fused images—enhancing accuracy by synergistically combining their predictive strengths. This comprehensive method directly addresses challenges surrounding concurrency, reliability, availability, and resolution in component identification. Through extensive experiments, we demonstrate that our approach not only significantly improves classification metrics but also enhances the learning and identification processes of PCB components, achieving a remarkable total accuracy of 95.2%. Our findings offer a substantial contribution to the ongoing development of reliable and accurate automatic inspection solutions in the electronics manufacturing sector.

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