Abstract:In a recent study of diffusional creep in polycrystalline thin films deposited on substrates, we have discovered a new class of defects called the grain boundary diffusion wedges (Gao et al., Acta Mat. 47, pp. 2865–2878, 1999). These diffusion wedges are formed by stress driven mass transport between the free surface of the film and the grain boundaries during the process of substrate-constrained grain boundary diffusion. The mathematical modeling involves solution of integro-differential equations representing a strong coupling between elasticity and diffusion. The solution can be decomposed into diffusional eigenmodes reminiscent of crack-like opening displacement along the grain boundary which leads to a singular stress field at the root of the grain boundary. We find that the theoretical analysis successfully explains the difference between the mechanical behaviors of passivated and unpassivated copper films during thermal cycling on a silicon substrate. An important implication of our theoretical analysis is that dislocations with Burgers vector parallel to the interface can be nucleated at the root of the grain boundary. This is a new dislocation mechanism in thin films which contrasts to the well known Mathews-Freund-Nix mechanism of threading dislocation propagation. Recent TEM experiments at the Max Planck Institute for Metals Research have shown that, while threading dislocations dominate in passivated metal films, parallel glide dislocations begin to dominate in unpassivated copper films with thickness below 400 nm. This is consistent with our theoretical predictions. We have developed large scale molecular dynamics simulations of grain boundary diffusion wedges to clarify the nucleation mechanisms of parallel glide in thin films. Such atomic scale simulations of thin film diffusion not only show results which are consistent with both continuum theoretical and experimental studies, but also revealed the atomic processes of dislocation nucleation, climb, glide and storage in grain boundaries. The study should have far reaching implications for modeling deformation and diffusion in micro- and nanostructured materials.

The driving force governing room temperature grain coarsening in thin gold films

Initiation and stagnation of room temperature grain coarsening in cyclically strained gold films

Coordinated grain boundary deformation governed nanograin annihilation in shear cycling

Atomistic dynamics of disconnection-me diate d grain boundary plasticity: A case study of gold nanocrystals

Direct Dynamic Atomic Mechanisms of Strain-Induced Grain Rotation in Nanocrystalline, Textured, Columnar-Structured Thin Gold Films

Kinetics and Energetics of Room-Temperature Microstructure in Nanocrystalline Cu Films: the Grain-Size Dependent Intragrain Strain Energy

Synergy of Elastic Strain Energy and Electron Wind Force on Thin Film Grain Growth at Room Temperature

Shear-assisted grain coarsening in colloidal polycrystals

Experiment and Simulation of Grain Growth in a Bidimensional Polycrystalline Film

Constrained Grain Boundary Diffusion in Thin Copper Films

Quantitative Measurement of Deformation Field Around Low-Angle Grain Boundaries by Electron Microscopy

The study of grain boundary density effect on multi-grain thin film under tension

Influence of Grain Boundary Scattering on the Electrical and Thermal Conductivities of Polycrystalline Gold Nanofilms

Mechanically-induced Grain Coarsening in Gradient Nano-Grained Copper

5542 - MULTI-SCALE MODELING OF DEFORMATION IN POLYCRYSTALLINE THIN METAL FILMS

Grain Growth and the Effect of Different Time Scales

Grain structure dependence of coercivity in thin films

Effect of grain boundary deformation on mechanical properties in nanocrystalline Cu film investigated by using phase field and molecular dynamics simulation methods

A Study of Strain-Driven Nucleation and Extension of Deformed Grain: Phase Field Crystal and Continuum Modeling

Theoretical analysis of strain energy-driven abnormal grain growth in metallic films with hcp ((c/a) < 1.633) structure on rigid substrates

In Situ Observation of Stress Induced Grain Boundary Migration in Nanocrystalline Gold