Bioadhesive and conductive hydrogel-integrated brain-machine interfaces for conformal and immune-evasive contact with brain tissue
Xiao Wang,Xiaotong Sun,Donglin Gan,Manon Soubrier,Hsin-Yin Chiang,Liwei Yan,Yingqi Li,Junjun Li,Shuang Yu,Yang Xia,Kefeng Wang,Qiaozhen Qin,Xiaoxia Jiang,Lu Han,Taisong Pan,Chaoming Xie,Xiong Lu
DOI: https://doi.org/10.1016/j.matt.2022.01.012
IF: 18.9
2022-04-01
Matter
Abstract:Brain-machine interfaces (BMIs) enable communication between the brain and external machines. However, mechanical and biological mismatches, as well as weak physical adhesion-induced shifts between rigid electronic devices and soft brain tissue, generally trigger a host immune response, affecting signal recording and reducing the lifespan of BMIs in clinics. Herein, we design a bioadhesive ultrasoft BMI based on integration of bioelectronics with a dopamine methacrylate-hybridized poly(3,4-ethylenedioxythiophene) nanoparticle (dPEDOT NP)-incorporated hydrogel with high conductivity. The hydrogel exhibits robust adhesiveness, enabling tight integration with metallic microcircuits and seamless adhesion to the brain tissue. Most importantly, the hydrogel exhibits a brain-level modulus that reduces its mechanical discrepancy with brain tissue. Meanwhile, the hydrogel possesses immune-evasive ability, which actively prevents fibrous tissue encapsulation and neuroinflammation after implantation. Consequently, the immune-evasive, bioadhesive, ultrasoft, and conductive hydrogel-integrated BMI permits long-term and accurate electroencephalographic signal acquisition and communication with minimal foreign body reaction.
materials science, multidisciplinary