Advances and Challenges in Large‐Area Perovskite Light‐Emitting Diodes

Hui Liu,Guangyi Shi,Chenchen Peng,Wenjing Chen,Haitao Yao,Zhengguo Xiao

DOI: https://doi.org/10.1002/adma.202410154

IF: 29.4

2024-09-25

Advanced Materials

Abstract:This review covers the key fabrication techniques for large‐area perovskite LEDs (PeLEDs), including spin coating, blade coating, inkjet printing, and vacuum thermal evaporation. The pros and cons of each method are discussed in detail, along with the latest advances in large‐area PeLEDs development. Specific challenges are discussed and potential improvement strategies are proposed, all of which are crucial for scalable PeLEDs production. The goal of this review is to offer guidelines for overcoming the challenges in fabricating large‐area devices. Metal halide perovskite light‐emitting diodes (PeLEDs) have shown promise for high‐definition displays and flat‐panel lighting because of their wide color gamut, narrow emission band, and high brightness. The external quantum efficiency of PeLEDs increased rapidly from ≈1% to more than 25% in the past few years. However, most of these high‐performance devices are fabricated using a spin coating method with a small device area of <0.1 cm2, limiting their commercial applications. Recently, large‐area PeLEDs have attracted growing attention and significant breakthroughs have been reported. This perspective first introduces the pros and cons of each technique in making large‐area PeLEDs. The advances in the fabrication of large‐area PeLEDs are then summarized using spin coating and mass‐production methods such as inkjet printing, blade coating, and thermal evaporation. Moreover, the challenging issues will be discussed that are urgent to be solved for large‐area PeLEDs.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology