150 mm SiC Engineered Substrates for High-Voltage Power Devices
Séverin Rouchier,Gweltaz Gaudin,Julie Widiez,Frederic Allibert,Emmanuel Rolland,Kremena Vladimirova,Guillaume Gélineau,Nicolas Troutot,Christelle Navone,Guillaume Berre,Daphnée Bosch,Yen Lin Leow,Alain Duboust,Alexis Drouin,Jean Marc Bethoux,Romain Boulet,Audrey Chapelle,Enrica Cela,Guillaume Lavaitte,Adeline Bouville-Lallart,Laurent Viravaux,Florence Servant,Shivan Bhargava,Shawn Thomas,Ionut Radu,Christophe Maleville,Walter Schwarzenbach
DOI: https://doi.org/10.4028/p-mxxdef
2022-06-01
Materials Science Forum
Abstract:Publication date: 31 May 2022 Source: Materials Science Forum Vol. 1062 Author(s): Séverin Rouchier, Gweltaz Gaudin, Julie Widiez, Frederic Allibert, Emmanuel Rolland, Kremena Vladimirova, Guillaume Gélineau, Nicolas Troutot, Christelle Navone, Guillaume Berre, Daphnée Bosch, Yen Lin Leow, Alain Duboust, Alexis Drouin, Jean Marc Bethoux, Romain Boulet, Audrey Chapelle, Enrica Cela, Guillaume Lavaitte, Adeline Bouville-Lallart, Laurent Viravaux, Florence Servant, Shivan Bhargava, Shawn Thomas, Ionut Radu, Christophe Maleville, Walter Schwarzenbach Silicon Carbide (SiC) Power Devices have emerged as a breakthrough technology for a wide range of applications in the frame of high power electronics. Despite the continuously improving quality and supply of 4H-SiC substrates, the availability of such wafers is still insufficient. An advantageous opportunity is offered by the Smart CutTM technology with the integration of a very high quality SiC layer transferred to a low resistivity handle wafer. This bi-layer material enables a significant yield optimization and improvement of the device's electrical performance. Moreover, an additional key feature of the Smart CutTM technology is the possibility to re-use multiple times the donor wafer, leading to reduced manufacturing costs and enabling the high volume production of SiC wafers. In this paper we report the latest advances in the development of such so called SmartSiCTM substrates.